Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Nathan Trotter Acquires LOCTITE Solder Bar Division of Henkel Electronics
January 4, 2017 | Nathan Trotter & Co.Estimated reading time: 1 minute
Nathan Trotter & Co. Inc. has acquired the LOCTITE solder bar division of Henkel Electronics. Prior to the acquisition, Nathan Trotter produced all LOCTITE solder bar sold in North America on behalf of Henkel Electronics. Effective immediately, LOCTITE solder bar will be produced and sold under the Nathan Trotter name. Nathan Trotter has partnered with E-Tronix as the master representative to facilitate the transition.
As a result of Nathan Trotter's already large presence in the tin industry, the acquisition is expected to generate significant sales and production efficiencies in the electronics assembly industry for tin/lead and lead-free solder alloys. Purity, performance and quality will remain at the same high standards set forth under the LOCTITE brand, while minimum order quantities will be reduced for the benefit of the customer.
"While we enjoyed our successful relationship with Henkel producing LOCTITE solder bar on their behalf, we look forward to showing the electronics assembly market the benefits of working directly with Nathan Trotter for solder bar and recycling services," said Luke Etherington, Vice President of Nathan Trotter & Co.
About Nathan Trotter & Co.
Founded in 1789, Nathan Trotter has grown to become the largest tin manufacturer in North America. ISO 9001 certified since 1997, Nathan Trotter currently serves the Automotive, Aerospace, Electronics, Plating, and Chemical industries globally.
Operating as the recycling division of Nathan Trotter & Co., Tin Technology and Refining is a world-class secondary tin refiner, serving the electronics assembly and recyclable non-ferrous industries. Tin Tech processes solder dross, solder paste, chunk, ingots, pot dumps, and contaminated debris from electronics assembly and industrial processes.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.