Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Nathan Trotter Acquires LOCTITE Solder Bar Division of Henkel Electronics
January 4, 2017 | Nathan Trotter & Co.Estimated reading time: 1 minute
Nathan Trotter & Co. Inc. has acquired the LOCTITE solder bar division of Henkel Electronics. Prior to the acquisition, Nathan Trotter produced all LOCTITE solder bar sold in North America on behalf of Henkel Electronics. Effective immediately, LOCTITE solder bar will be produced and sold under the Nathan Trotter name. Nathan Trotter has partnered with E-Tronix as the master representative to facilitate the transition.
As a result of Nathan Trotter's already large presence in the tin industry, the acquisition is expected to generate significant sales and production efficiencies in the electronics assembly industry for tin/lead and lead-free solder alloys. Purity, performance and quality will remain at the same high standards set forth under the LOCTITE brand, while minimum order quantities will be reduced for the benefit of the customer.
"While we enjoyed our successful relationship with Henkel producing LOCTITE solder bar on their behalf, we look forward to showing the electronics assembly market the benefits of working directly with Nathan Trotter for solder bar and recycling services," said Luke Etherington, Vice President of Nathan Trotter & Co.
About Nathan Trotter & Co.
Founded in 1789, Nathan Trotter has grown to become the largest tin manufacturer in North America. ISO 9001 certified since 1997, Nathan Trotter currently serves the Automotive, Aerospace, Electronics, Plating, and Chemical industries globally.
Operating as the recycling division of Nathan Trotter & Co., Tin Technology and Refining is a world-class secondary tin refiner, serving the electronics assembly and recyclable non-ferrous industries. Tin Tech processes solder dross, solder paste, chunk, ingots, pot dumps, and contaminated debris from electronics assembly and industrial processes.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.