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DesignCon 2017 Announces Heidi Barnes as Winner of the Engineer of the Year Award
February 3, 2017 | DesignConEstimated reading time: 2 minutes
DesignCon today announced Heidi Barnes of Keysight Technologies as the recipient of the 2017 Engineer of the Year Award. Selected for her dedication to problem solving and enthusiasm for leading and collaborating with teams, Barnes was awarded earlier today at DesignCon. The conference took place this week, January 31 – February 2, at the Santa Clara Convention Center. For additional information please visit: designcon.com.
"I am thrilled to be named the recipient of the Engineer of the Year Award by DesignCon," said Heidi Barnes, senior applications engineer for high speed digital applications in the EEs of EDA Group, Keysight Technologies. "We've made tremendous strides in this space and it's an honor to receive an award where industry luminaries including Eric Bogatin and Michael Steinberger were also named winners."
This prestigious award recognizes professionals in the engineering community that lead, develop and contribute to the design and test of chips, boards or systems. Award nominees were put forth by peers, finalists were carefully selected by the Design News editorial staff and the winner was voted for by the DesignCon community. With this achievement, Barnes will be provided with a $10,000 grant or scholarship that she has chosen to present to Harvey Mudd College.
Barnes is known for her ability to solve problems in the signal integrity (SI) and power integrity (PI) field for Fortune 500 companies, serves on the DesignCon Technical Program committee and leads conference planning as a co-chairperson for the test and measurement track. At DesignCon 2017, Barnes presented in technical sessions and tutorials on SI and PI, and participated in various panels.
"Heidi continuously proves her commitment to SI and PI with her involvement in DesignCon planning and presenting, and received an impressive seven nominations for the 2017 Engineer of the Year award," said Naomi Price, conference content director, DesignCon. "Her colleagues hold her in the highest regard for her ability to lead teams and develop thoughtful, logical and technical ideas, as she designs and works with some of the most complex channels and tools in the industry. Given these characteristics, it's no surprise she was selected as the award winner. I'd like to congratulate Heidi on receiving this recognition, and also congratulate the other award finalists."
Finalists for the 2017 Engineer of the Year award include Istvan Novak, senior principal engineer at Oracle, Krishnaswamy Ramkumar, senior technical staff member at Cypress Semiconductor, Ransom Stephens, principal at Ransom's Notes, and Yuriy Shlepnev, CEO at Simberian Inc.
For more information on DesignCon 2017 Engineer of the Year Award, please click here.
DesignCon Media & Association Partners
DesignCon is proud to partner with the following publications: Aspencore, Chinese American Semiconductor Professional Association (CASPA), Chip Design Magazine, ConnectorSupplier.com, EDA Café, Electronic System Design Alliance, Embedded Systems Engineering, How2Power, IBIS Open Forum, Microwave Journal, Signal Integrity Journal.
About DesignCon
DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: designcon.com/santaclara. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit ubmamericas.com.
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