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IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging

11/26/2024 | Yusaku Kono, IPC Japan Representative
In the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.

IPC Introduces First Standard for In-Mold Electronics

11/18/2024 | IPC
IPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.

American Standard Circuits to Exhibit at the 2024 Annual Symposium of The Association of Old Crows

11/19/2024 | American Standard Circuits
Anaya Vardya, President and CEO of American Standard Circuits/ASC Sunstone announced that his company will be exhibiting at the Annual Conference and Symposium of the Association of Old Crows to be held December 11 through the 13 in National Harbor, Maryland.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Chapter 2

11/14/2024 | I-Connect007 Editorial Team
The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter discusses panelization, placing PCBs on manufacturing panels, highlighting features like coupons, borders, and scoring to maximize material utilization and reduce costs, and detailing preferred panel sizes and modifications.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

11/08/2024 | Nolan Johnson, I-Connect007
In our industry we work on solutions. This week, solutions are represented in these must-read choices. Solid state batteries make an appearance, as does LED imaging equipment at American Standard Circuits. SPEA’s AI-based optical inspection is here, as are Happy Holden’s recent article on one key engineering skill and news about a flagship R&D facility funded by the U.S. CHIPS Act.​​​​​​​
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