American Standard to Participate in European Microwave Week 2025
September 5, 2025 | American Standard CircuitsEstimated reading time: 1 minute
Anaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will once again be taking part in European Microwave Week, Europe’s premier RF, microwave, radar and wireless event, to be held from September 21-26, 2025 at Jaarbeurs in Utrecht, The Netherlands.
“As we grow our Microwave PCB business, extending from North American into Europe, this event has become increasingly important to us. With the extensive expansion of our capabilities and technology, we must attend international events to make sure we are telling our story to the customers and prospects that may need our service. This show is the right place to do just that,” said Mr. Vardya when making the announcement.
To visit the American Standard Circuits team to discuss your latest Microwave PCB project visit them on the show floor in Booth A041.
Check out these educational offerings from American Standard Circuits | ASC Sunstone:
- The Printed Circuit Designer's Guide to... DFM Essentials
- The Printed Circuit Designer’s Guide to... Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to... Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
- On the Line with...ASC Sunstone: Design for Manufacturing Podcast
Visit I-007eBooks.com to download these and other free titles.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Vuzix Ships Follow-On Production Order from Major Defense Customer for Waveguide-Based AR
04/06/2026 | PRNewswireVuzix® Corporation, a leading supplier of AI-powered smart glasses, waveguides, and augmented reality technologies, announced that it has received and shipped against a new six-figure follow-on production order for waveguide-based AR display systems from a U.S.-based company that is a leader in technologically advanced and intelligent solutions for the global aerospace and defense industry.
Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics
03/18/2026 | I-Connect007I-Connect007 proudly announces the release of The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection. As electronics grow more complex, geometries shrink, and packaging densities increase, traditional testing and inspection methods are no longer sufficient. In this timely new release, industry expert Bert Horner of The Test Connection, Inc. provides a practical roadmap for integrating design for test (DFT) into PCB and CCA development, beginning at schematic capture and layout, rather than treating testing as an afterthought.
Companion Guide to Popular UHDI Podcast Series Now Available for Download
03/23/2026 | I-Connect007The companion guide to On the Line With…American Standard Circuits: Ultra High Density Interconnect (UHDI) explores how UHDI is reshaping PCB design and manufacturing. As trace widths shrink from 25 microns toward 5 microns, UHDI enables finer geometries, tighter impedance control, improved RF performance, and reduced layer counts.
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
03/06/2026 | I-Connect007I-Connect007 announces the release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new book offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
Rethinking Test Strategy: New Book Tackles DFT for Today’s Complex Electronics
03/10/2026 | I-Connect007I-Connect007 proudly announces the release of The Printed Circuit Assembler’s Guide to… Design for Test: A Practical Guide to Test and Inspection. This comprehensive guide explores smarter access strategies for today’s high-density designs, including boundary scan, built-in self-test (BIST), flying probe, in-circuit test (ICT), and functional testing. Central to the book is the PCOLA-SOQ framework, a structured, measurable method for evaluating inspection and test coverage at both the component and pin levels.