IPC Volunteers Honored for Contributions to Electronics Industry at IPC APEX EXPO

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For their leadership of the IPC 4-35CN Corporate Social Responsibility and Sustainability in the Supply Chain in China Subcommittee that developed IPC-1401CN, Supply Chain Social Responsibility Management System Guidance, Bruce Klafter, Flextronics International and Peter Zhou, Huawei technologies Co., Ltd, earned a Committee Leadership Award.

For their leadership of the IPC 2-19a Task Group that developed IPC-1782, Standard for Manufacturing and Supply Chain Traceability of Electronic Products, Michael Ford, Mentor Graphics Corporation and Cameron Shearon,  AT&T Services, Inc., earned a Committee Leadership Award. For their contributions to IPC-1782, Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Gary Carter, ThingWeaver Solutions, LLC; Kevin Dudley, Sanmina Corporation; Manon Dutil, Cogiscan, Inc.; Zac Elliott, Mentor Graphics; Bradley Fern, Entrust Datacard Corporation; Dennis Fritz, SAIC; Dennis Gagne, Juniper Networks; Karen McConnell, Northrop Grumman Corporation; Francois Monette, Cogiscan Inc.; Cengiz Oztunc, DNZ Ltd.; Jan Pedersen, Elmatica AS; Keith Peterson, Missile Defense Agency; Lance Rist, Ristex; Brian Rubow, Cimetrix Inc.; Aimee Siegler, Benchmark Electronics, Inc.; Marco  van Oosterhout, Kulicke and Soffa; and Scott Wischoffer, Fuji America Corporation, earned a Distinguished Committee Service Award.

For their leadership of the D-11 Subcommittee that developed IPC-2223D, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards, Mark Finstad, Flexible Circuit Technologies, Inc. and William Ortloff, Raytheon Company, earned a Committee Leadership Award. For their contributions to IPC-2223D, Lance Auer, Raytheon Missile Systems; Michael Beauchesne, BAE Systems; Scott Bowles, L-3 Fuzing and Ordnance System; Rachel Grinvalds, Rockwell Collins; John Leschisin, Minco Products, Inc.; Glenn Oliver, Raytheon Missile Systems; and Robert Sheldon, Pioneer Circuits Inc., earned a Distinguished Committee Service Award.

For his leadership of the D-33aa Task Group that developed IPC-6012DA, Automotive Applications Addendum to IPC-6012D, Jan Pedersen, Elmatica AS, earned a Committee Leadership Award. For their contributions to IPC-6012DA, Nancy Deng, Ford Motor Researching & Engineering; Laurent Nardo, Continental Automotive France SAS; Ralf-Michael Sander, Papst-Motoren GmbH & Company; Michael Schoening, Q-Products Enterprise Limited; Marcel Smeets, Viasystems Mommers BV; and Udo Welzel, Robert Bosch GmbH, earned a Distinguished Committee Service Award.

For their leadership of the B-11 3-D Electronic Packages Subcommittee that developed IPC-7091, Design and Assembly Process Implementation for 3D Components, Dudi Amir, Intel Corporation and Vern Solberg, Solberg Technical Consulting, earned a Committee Leadership Award. For their contributions to IPC-7091, Michael Carano, RBP Chemical Technology, Inc.; Marie Cole, IBM Corporation; Gerd Fischer, NASA Goddard Space Flight Center; Dennis Fritz, MacDermid Enthone Electronics Solutions; Reza Ghaffarian, Jet Propulsion Laboratory; Ife Hsu, Intel Corporation; Bruce Hughes, AMRDEC MS&T EPPT; Rajesh Kumar, TTM Technologies; Maurice LeBlon, AI Technologies, Inc.; Steven Martell, Sonoscan Inc.; Craig Mitchell, Tessera Technologies, Inc.; Richard Otte, PROMEX Industries, Inc.; Keith Peterson, Missile Defense Agency; Ray Prasad, Ray Prasad Consultancy Group; Raj Pulugurtha, Georgia Institute of Technology; Jagadeesh Radhakrishnan, Intel Corporation; and Mamoru (Mark) Takahashi, Asahi Glass Co., Ltd., earned a Distinguished Committee Service Award.

For their leadership of the IPC 5-22h Task Group that developed IPC-7530A, Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave), Ray Prasad, Ray Prasad Consultancy Group and Robert Rowland, Axiom Electronics, LLC, earned a Committee Leadership Award. For their contributions to IPC-7530A, Dudi Amir, Intel Corporation; Raiyomand Aspandiar, Intel Corporation; Paul Austen, Electronic Controls Design Inc.; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Gerd Fischer, NASA Goddard Space Flight Center; Mitchell Holtzer, Alpha Assembly Solutions; Ife Hsu, Intel Corporation; Jennie Hwang, H-Technologies Group; Michael Johnson, M/A-COM Technology Solutions, Inc.; Milea Kammer, Honeywell Aerospace; Leo Lambert, EPTAC Corporation; Ursula Marquez de Tino, Plexus Corporation; Jagadeesh Radhakrishnan, Intel Corporation; Chris Smith, Plexus Corporation; Vern Solberg, Solberg Technical Consulting; and Udo Welzel, Robert Bosch GmbH, earned a Distinguished Committee Service Award.

For their contributions to the IPC 5-22jCN Solder Dross Reduction Chemicals Task Group that developed IPC-7535CN, Requirements for Solder Dross Reduction Chemicals, Jay Hardin, P. Kay Metal, Inc.; Murad Kurwa, GE Healthcare; Ahmer Qasim, Flextronics International; Joshua Tam, Jabil Circuit (GuangZhou) Ltd; and Joe Zhong, Jabil Circuit (GuangZhou) Ltd, earned a Distinguished Committee Service Award.

For their leadership of the 7-34 Subcommittee that developed IPC-7711/7721C, Rework, Modification and Repair of Electronic Assemblies, Daniel Foster, Missile Defense Agency and Bruce Hughes, AMRDEC MS&T EPPT, earned a Committee Leadership Award. For their contributions to IPC-7711/7721C, James Daggett, Raytheon Company; Patrick Kane, Raytheon System Technology; Gary Latta, SAIC; John Mastorides, Honeywell Aerospace; Gregg Owens, Millennium Space Systems; Martin Scionti, Raytheon Missile Systems; Zenaida Valianu, Celestica; Sharon Ventress, U.S. Army Aviation & Missile Command; Debbie Wade, Advanced Rework Technology-A.R.T., earned a Distinguished Committee Service Award.

For their contributions to the D-65 Subcommittee that developed IPC-9204, Guideline on Flexibility and Stretchability Testing for Printed Electronics, Neil Bolding, MacDermid Enthone Electronics Solutions and Weifeng Liu, FLEX, earned a Committee Leadership Award. For their contributions to IPC-9204, Len Allison, Engineered Materials Systems, Inc.; Don Dupriest, Lockheed Martin Missiles & Fire Control; Ken Gann, Lab Tech; MaryAlice Gill, Jabil Circuit, Inc.; Karen McConnell, Northrop Grumman Corporation, Haridoss Sarma, GO 2 Scout 4 R&T; and Mobin Yahyazadehfar, DuPont Engineering Polymers, earned a Distinguished Committee Service Award.

For their leadership of the 7-12 subcommittee that developed IPC-9241, Guidelines for Microsection Preparation, Randy Reed, R. Reed Consultancy LLC and Russell Shepherd, National Technical Systems – Anaheim, earned a Committee Leadership Award. For their contributions to IPC-9241, Denise Chevalier, Amphenol Printed Circuits, Inc.; Stefan Gerhold, Atotech Deutschland GmbH; Vicka Hammill, Honeywell Inc. Air Transport Systems; Chris Mahanna, Robisan Laboratory Inc.; and Joey Rios, Massachusetts Institute of Technology, earned a Distinguished Committee Service Award.

For his leadership of the 7-31bc A-610 Task Group that developed IPC-A-610, Telecom Addendum, Darrin Dodson, Nokia, earned a Committee Leadership Award.

For his leadership of the 7-31m Task Group that developed IPC-A-640, Acceptance Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies, Robert Cooke, NASA Johnson Space Center, earned a Committee Leadership Award.

For their significant contributions to IPC-A-640, Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Robert Cooke, NASA Johnson Space Center; and Larry Johnson, Light Brigade, earned a Special Recognition Award.

For their contributions to IPC-A-640, Richard Agard, SEPTA; Caroline Ehlinger, Rockwell Collins; B.J. Franco, Honeywell Aerospace; Symon Franklin, Custom Interconnect Ltd.; Stephen Fribbins, Fribbins Training Services; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Kathy Johnston, Raytheon Missile Systems; Sean Keating, Amphenol Limited (UK); Gregory Manning, Ares Corporation; James McGrath, Lockheed Martin Mission Systems & Training; Randy McNutt, Northrop Grumman Aerospace Systems; Gregg Owens, Millennium Space Systems; Agnieszka Ozarowski, BAE Systems; Mel Parrish, Soldering Technology International; Darrell Sensing, BAE Systems; Brian Smith, Rockwell Collins; John Tinker, Teledyne Reynolds; Hector Valladares, Honeywell Aerospace; Debie Vorwald, Rockwell Collins; and Schuyler Williams, Lockheed Martin Missile & Fire Control, earned a Distinguished Committee Service Award.

For their leadership of the 5-22f Task Group that developed IPC-HDBK-001F with Amendment 1, Handbook and Guide to Supplement J-STD-001, Daniel Foster, Missile Defense Agency and Kathy Johnston, Raytheon Missile Systems, earned a Committee Leadership Award. For their contributions to IPC-HDBK-001F with Amendment 1, David Adams, Rockwell Collins; James Daggett, Raytheon Company; Charles Gamble, NASA Marshall Space Flight Center; Joseph Kane, BAE Systems Platform Solutions; Patrick Kane, Raytheon System Technology; John Mastorides, Honeywell Aerospace; Garry McGuire, NASA Marshall Space Flight Center; Scott Meyer, UTC Aerospace Systems; Gregg Owens, Millennium Space Systems; Pamela Petcosky, Lockheed Martin Mission Systems & Training; Sue Powers-Hartman, Killdeer Mountain Manufacturing, Inc.; Zenaida Valianu, Celestica; and Sharon Ventress, U.S. Army Aviation & Missile Command, earned a Distinguished Committee Service Award.

For their leadership of the 5-22as task group that developed J-STD-001FS with Amendment 1, Space Applications Electronic Hardware Addendum to IPC J-STD-001F with Amendment 1 Requirements for Soldered Electrical and Electronic Assemblies, Kathy Johnston, Raytheon Missile Systems and Garry McGuire, NASA Marshall Space Flight Center, earned a Committee Leadership Award. For their contributions to J-STD-001FS with Amendment 1, James Blanche, NASA Marshall Space Flight Center; Robert Cooke, NASA Johnson Space Center; James Daggett, Raytheon Company; Stepfan Hanigk, Airbus Safran Launchers; Joseph Kane, BAE Systems Platform Solutions; Gregg Owens, Millennium Space Systems; Richard Rumas, Honeywell Canada; James Saunders, Raytheon Company; Bhanu Sood, NASA Goddard Space Flight Center; Jonathon Vermillion, Ball Aerospace & Technologies Corporation; and Ge Wang, Northrup Grumman Aerospace Systems, earned a Distinguished Committee Service Award.

Photos from the IPC APEX EXPO committee awards ceremonies are available at https://flic.kr/s/aHskRK7mMp. For more information on these awards or the award recipients, contact Sandy Gentry, IPC communications manager, at +1 847-597-2871.

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