Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Terran Orbital’s GEOStare SV2 Captures 3 Years of Success in High-Resolution Imaging

05/17/2024 | BUSINESS WIRE
Terran Orbital Corporation, a global leader in satellite-based solutions primarily serving the aerospace and defense industries, celebrates the 3rd anniversary of its successful GEOStare SV2 mission. Launched on May 15, 2021, from NASA’s Kennedy Space Center in Florida, GEOStare SV2 has surpassed expectations, delivering exceptional results for commercial satellite imagery.

Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC

05/16/2024 | Indium Corporation
Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.

Siemens, Foxconn Team Up to Optimize Forward-thinking Manufacturing

05/16/2024 | Foxconn
Siemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.

TactoTek Licenses IMSE Technology to Polestar for Sustainable Electronics Design Innovation

05/15/2024 | TactoTek
Polestar, the Swedish electric performance car brand, and Finnish smart surface pioneer TactoTek, have entered a collaboration to explore integration of Injection Molded Structural Electronics (IMSE) technology into Polestar’s vehicle programs.

SiPearl: Partnership with Samsung Electronics for built-in HBM in Rhea

05/14/2024 | BUSINESS WIRE
SiPearl, the company building the high-performance low-power European microprocessor for HPC and AI inference, has signed a partnership with Samsung Electronics Co. Ltd., a world leader in advanced memory technology, to equip its Rhea series with Samsung’s advanced memory solution ideal for HPC and AI applications.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in