-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Viscom Unveils Optimal Optical 3D Solder Joint Measurement
March 30, 2017 | Viscom AGEstimated reading time: 2 minutes
With a combination of intelligent software and the high-performance camera module XMplus, Viscom AG is perfecting automatic optical inspection (AOI), which also includes optimal 3D solder joint measurement. As a result, users receive definite and easy-to-interpret information and, with it, the best possible quality assurance for electronic components.
Solder joint measurement using 3D AOI is a central component of this spring's release of vVision and SI. Viscom presents both new software versions at the SMT show in Nuremberg, Germany. The access to exact measuring results helps users to create 3D AOI inspection programs and thus ensures a high efficiency. The three-dimensional measurement with the high-speed Viscom XMplus camera module produces easy-to-classify height and position values. Users can easily interpret these intuitive values in practice.
Quality of the data is extremely important for accurate, reliable measurement. To evaluate a solder joint with 3D AOI from Viscom, several height profiles are measured at the solder meniscus with a high resolution of 10 µm. The XMplus camera module is optimally suited for this sophisticated task. Its angled cameras ensure the best panorama view of components and their solder joints from all eight directions. The high-performance software used also guarantees maximum speeds throughout the measurement and inspection process.
The measured profiles of a solder joint are evaluated using a mathematical procedure and presented in an easily interpreted overall result. An additional advantage: This improved evaluation results in fewer false calls and thus increases production efficiency. This combination of intelligent software and very powerful hardware offers customers options for efficient use.
Besides evaluating solder joints, exact detection of component orientation is also an increasingly important application. For example, in the ever-smaller LEDs that are increasingly being installed in vehicle lamps and headlights, even minimal tilting is a defect. Exact measurement values are needed for a final quality evaluation, and these are ensured with a Viscom 3D AOI.
About Viscom
Viscom AG develops, manufactures and sells high-quality inspection systems. The portfolio encompasses the complete bandwidth of optical and X-ray inspections. In the area of assembly inspection for electronics manufacturing, the company is among the leading suppliers worldwide. Viscom systems can be configured specifically to the customer and can be interlinked. The company headquarters and manufacturing location is in Hanover, Germany. With a wide network of branches, applications centers, service support points and representatives, Viscom is represented internationally. Founded in 1984, since 2006 Viscom has been listed on the Frankfurt Stock Exchange (ISIN: DE0007846867).
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.