Yamaha to Display YSM40R Mounter at SMT Hybrid Packaging 2017
April 12, 2017 | Yamaha Motor IMEstimated reading time: 3 minutes

Yamaha Motor IM Europe will showcase the award-winning YSM40R Ultra-High-Speed Modular surface mounter as part of its full line solution at SMT Hybrid Packaging 2017, which will be held from May 16-18, in Nuremberg, Germany. Yamaha will be in Booth 321, Hall 4.
The YSM40R’s 200,000 cph placement capability and area-efficient 1m-wide outline frees OEMs and contract assemblers to increase capacity and maximize use of available space. Visitors can see for themselves the technical advances in head, feeder, camera and nozzle technologies – including high-speed motion and simultaneous multi-component visual recognition – that enable such extremely high productivity per square metre.
Visitors to Nuremberg can see further powerful options for configuring fast and flexible SMT lines, including the High-Efficiency Modular YSM20 2-beam mounter and iPulse S10 and M20 hybrid mounters. The YSM20 features innovations including smart component-shape recognition and accuracy compensation. With Yamaha’s efficient “1-head solution” concept and special design features for fast changeovers, YSM20 delivers market-leading productivity in the 90,000 cph class. The YSM20 family also includes the wide-body YSM20W; a flexible, efficient inline mounter for emerging opportunities in markets such as LED lighting, medical, Cloud and automotive that demand precision placement on large or heavy boards.
Yamaha’s S10 and M20 hybrid mounters give the option of built-in adhesive dispensing, and have capacity for 90 or 180 feeders respectively. They can place components from tiny chips and CSPs to larger ICs and connectors on long boards such as large LED assemblies. The M20 accepts boards up to 1.48 metres long, allows multiple head choices to balance speed and precision, and can place odd-form components. Options and upgrades for the S10 3D mounter enable component placement on contoured or tilted boards, and Moulded Interconnect Device (MID) assembly.
Extra Productivity, from Screen Print to Inspection
In addition, Yamaha will present advanced solutions spanning high-speed high-resolution screen printing and visual inspection, and powerful software products that are affordable, easy to use, and take advantage of Yamaha’s unique inter-machine data structures. These empower operators to manage their activities for optimum efficiency, and provide deeper insights into equipment health and production status.
The high-performance, compact equipment theme continues with the YCP10 screen printer. This features Yamaha’s original swing-single-squeegee head with variable angle for ultimate efficiency and perfect paste transfer. Further features that boost productivity include easy-to-use graphical alignment, automatic stencil cleaning, and options such as in-printer inspection and solder-roll measurement.
Booth displays will also express how recent additions to the YSi-V AOI family greatly expand access to high-accuracy 3D optical inspection augmented by laser component-height and coplanarity checking. 5Mpixel and 12Mpixel configurations with multi-angle/multi-wavelength inspection, and the high-speed TypeHS variants that incorporate additional technologies to accelerate throughput, provide options to suit many budgets.
To help customers secure the maximum performance all the way along the line, Yamaha continues to refine and extend its line-management and productivity software products. These range from simple smartphone/tablet apps that alert supervisors wherever they are in the event of an event needing attention, to powerful tools for optimizing setup, real-time monitoring and management, and traceability. iProDB stores and analyses inspection results to assess the status of Yamaha equipment such as printer and mounters in the line, and helps identify opportunities to raise quality through process optimization and improvements to product design.
Yamaha’s full-line solutions portfolio comprises printers, dispensers, mounters, odd-form assemblers, optical and X-ray 3D inspection systems, advanced robotic assemblers, programming and monitoring software. Users can also benefit from a large selection of productivity boosters such as self-calibrating auto-load feeders and stacked-stick feeders, in addition to software tools and mobile apps.
About Yamaha Motor IM
Yamaha Motor IM is a subdivision of Yamaha Motor Corporation. Yamaha IM surface mounters are highly acclaimed in the market for their “module concept” that enables them to keep pace with the trend toward smaller and more diverse electric/electronic parts being mounted on circuit boards.
Yamaha Motor IM has created a strong business in the surface mounter industry that enables design and engineering, manufacture, sales and service to be conducted in one comprehensive system. Furthermore, the Company has used its core technologies in the areas of servo-motor control and image recognition technology for vision (camera) systems to develop solder paste printers, printed circuit board inspection machines, flip chip hybrid placers and dispensers. This allows Yamaha Motor IM to offer a full line of machines for electric/electronic parts mounting and propose optimum production-line makeup to answer the diversifying needs of today’s manufacturers.
Yamaha Motor IM has sales and service offices in Japan, China, Southeast Asia, Europe and North America provide a truly global sales and service network that will safeguard best in class on-site sales & service support for clients. For more information, click here.
Suggested Items
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.