Synopsys, GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
September 5, 2025 | GlobalFoundriesEstimated reading time: 2 minutes
Synopsys, Inc. and GlobalFoundries (GF) announced a new collaboration to launch an educational ‘chip design to tapeout’ program for universities worldwide. Aligned with both GFLabs’ and Synopsys Academic & Research Alliances’ (SARA) missions to advance semiconductor innovation through R&D and academic collaboration, this pilot initiative gives researchers, professors and students hands-on access to real-world chip design and manufacturing. By dramatically lowering the cost barrier to custom silicon, the program enables academic institutions to turn their design concepts into working silicon, expanding opportunities for education, research and workforce development.
Forty universities worldwide are participating in the sponsored open-source 180MCU pilot launching this fall. Synopsys will provide comprehensive support including professional-grade electronic design automation (EDA) tools, training and design collateral leveraging the Synopsys Cloud design platform. Once designs are finalized, GF will manufacture the chips through its GlobalShuttle Multi-Project Wafer Program, which aggregates designs from multiple institutions onto a single wafer for fabrication.
“Partnering with GlobalFoundries to bring a full ‘chip design to tapeout’ course to universities is a game changer,” said Dr. Patrick Haspel, executive director of SARA at Synopsys. “This collaboration will empower students with practical, hands-on experience using advanced tools and technologies – skills that are critical to drive innovation in the semiconductor industry. Together, we’re not just teaching design – we’re building the next generation of engineers who will shape the future of silicon.”
As Synopsys and GF seek to evolve this workforce development initiative further, the next phase of the tapeout is focused on bringing these technologies directly into classrooms and embedding hands-on design and testing into academic course curriculum. With the goal of having students collaborate in a design class, Synopsys will provide training to professors on how to lead this course. Following a shuttle run, the second course will dive into classroom testing with chips returned for the next semester.
“This program reflects our deep commitment to advancing semiconductor innovation and cultivating the next generation of talent,” said Bika Carter, director of external R&D at GF. “By giving students and researchers the opportunity to bring their designs from concept to silicon, we’re enriching chip design education and helping shape the future of our industry. We’re proud to partner with Synopsys to empower the talented minds driving tomorrow’s breakthroughs.”
This design enablement collaboration is supported by Synopsys’ SARA program, which provides software, cloud environments, training and curriculum to equip students with latest technology and learning materials. The new Synopsys-GF collaboration exemplifies the SARA program’s commitment to partner on semiconductor workforce development initiatives and nurture talent pipelines worldwide. Along with providing participating universities with essential tools and cloud environment access, the SARA program will also offer comprehensive course content and training.
The tapeout education pilot is just one aspect of GF’s University Partnership Program, which serves to close the prototyping gap in academia and expand access to new technologies to support technological innovation in the semiconductor industry. In its work with more than 80 universities, 110 professors and 600 students, the program selects projects aligned with GF’s R&D roadmap priorities to support research breakthroughs in areas including radio frequency, radar, quantum computing, silicon photonics, sensors and more.
The combination of Synopsys and GlobalFoundries brings together industry-leading EDA design tools and advanced manufacturing, empowering academic institutions to offer students an integrated, real-world journey through the semiconductor process.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
American Standard to Participate in European Microwave Week 2025
09/05/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will once again be taking part in European Microwave Week, Europe’s premier RF, microwave, radar and wireless event, to be held from September 21-26, 2025 at Jaarbeurs in Utrecht, The Netherlands.
Kris Moyer Discusses His Emerging Design Technologies Class
09/04/2025 | Marcy LaRont, I-Connect007Kris Moyer, a design instructor for the Global Electronics Association, will be teaching his advanced PCB design class this fall. If you’re ready to level up your design education, you won’t want to miss this interview. The PCB Design for Emerging Design Technologies course is designed to provide the skills necessary to create PCB/PBA designs that require cutting-edge emerging design technologies and comply with all necessary IPC standards, including new standards being developed in this area.
Synopsys Announces Expanding AI Capabilities for its Leading EDA Solutions
09/04/2025 | SynopsysSynopsys announced expanding Synopsys.ai™ Copilot generative AI (GenAI) capabilities for its industry-leading semiconductor design solutions, enabling semiconductor engineering teams to accelerate development timelines, support significantly more complex designs, and increase engineering velocity amidst a workforce shortage.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.