-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Balver Zinn Group at SMT Hybrid Packaging 2017
May 1, 2017 | Balver Zinn GroupEstimated reading time: 1 minute
The Balver Zinn Group announces that it will exhibit in Hall 4, Booth #231 at SMT Hybrid Packaging scheduled to take place May 16-18 in Nuremberg, Germany. The Balver Zinn Group will highlight the company’s latest products, technologies and services.
The upcoming SMT trade show in Nuremberg is the German platform to discover the brand new solder SN100CV. Balver Zinn is a pioneer in lead free solders and as exclusive licensee we present Nihon Superiors new patented SN100CV lead-free micro-alloyed solder. The industry standard SN100C has been improved by the addition of bismuth which has positive effects on the reliability of the solder joints. The SN100CV alloy offers high reliable solder joints which are recommended for high-end and automotive electronics.
Also at the show, the Balver Zinn group will introduce a wide range of adhesives for different electronics applications such as semiconductor assembly, automotive and consumer electronics. SMTA-0240 is a solvent-free, one component, pre-mixed, thermoset epoxy based adhesive. It has been designed especially for the bonding of surface mount devices, to printed circuit boards, prior to the wave soldering process.
SMTA-0240 is characterized by excellent stencil print-ability, resulting in high dot profiles, without aperture-stringing or tailing.
It can resist temperatures over 200ºC for short periods of time and has been used in lead-free processes with peak temperatures of 270ºC.
The Balver Zinn group will introduce the latest flux technology Cobar BF-1301 wave soldering flux.
Cobar BF-1301 is the latest alcohol based organic flux technology which exhibits exceptional wetting in combination with highest possible SIR of the residues. Using this flux in a nitrogen atmosphere will lead to the lowest residue which is very beneficial for pin testability and coat ability of the products. Higher first pass yields will be achieved and will reduce the cost of production.
Also on display at SMT Hybrid Packaging will be Cobar solder paste, Spectrocheck DEMO-machine and live soldering sessions with Hakko soldering stations.
About Balver Zinn Group
Headquartered in Germany, the Balver Zinn Group has facilities in the United States, Europe and distributors in all major areas of the world. Balver Zinn – Cobar product range includes: solder bar, solder wire, solder flux, gel flux, cleaner, solder paste and miscellaneous service and soldering products. For information about the company’s complete range of solder materials, visit www.balverzinn.com or www.cobar.com.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.