-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Balver Zinn Group at SMT Hybrid Packaging 2017
May 1, 2017 | Balver Zinn GroupEstimated reading time: 1 minute
The Balver Zinn Group announces that it will exhibit in Hall 4, Booth #231 at SMT Hybrid Packaging scheduled to take place May 16-18 in Nuremberg, Germany. The Balver Zinn Group will highlight the company’s latest products, technologies and services.
The upcoming SMT trade show in Nuremberg is the German platform to discover the brand new solder SN100CV. Balver Zinn is a pioneer in lead free solders and as exclusive licensee we present Nihon Superiors new patented SN100CV lead-free micro-alloyed solder. The industry standard SN100C has been improved by the addition of bismuth which has positive effects on the reliability of the solder joints. The SN100CV alloy offers high reliable solder joints which are recommended for high-end and automotive electronics.
Also at the show, the Balver Zinn group will introduce a wide range of adhesives for different electronics applications such as semiconductor assembly, automotive and consumer electronics. SMTA-0240 is a solvent-free, one component, pre-mixed, thermoset epoxy based adhesive. It has been designed especially for the bonding of surface mount devices, to printed circuit boards, prior to the wave soldering process.
SMTA-0240 is characterized by excellent stencil print-ability, resulting in high dot profiles, without aperture-stringing or tailing.
It can resist temperatures over 200ºC for short periods of time and has been used in lead-free processes with peak temperatures of 270ºC.
The Balver Zinn group will introduce the latest flux technology Cobar BF-1301 wave soldering flux.
Cobar BF-1301 is the latest alcohol based organic flux technology which exhibits exceptional wetting in combination with highest possible SIR of the residues. Using this flux in a nitrogen atmosphere will lead to the lowest residue which is very beneficial for pin testability and coat ability of the products. Higher first pass yields will be achieved and will reduce the cost of production.
Also on display at SMT Hybrid Packaging will be Cobar solder paste, Spectrocheck DEMO-machine and live soldering sessions with Hakko soldering stations.
About Balver Zinn Group
Headquartered in Germany, the Balver Zinn Group has facilities in the United States, Europe and distributors in all major areas of the world. Balver Zinn – Cobar product range includes: solder bar, solder wire, solder flux, gel flux, cleaner, solder paste and miscellaneous service and soldering products. For information about the company’s complete range of solder materials, visit www.balverzinn.com or www.cobar.com.
Suggested Items
Technica Installs CBT/MLI Direct Imaging System at Summit Interconnect Santa Clara
01/14/2025 | Technica USATechnica has recently installed the 6th CBT/MLI Direct Imaging (DI) system at Summit Interconnect's Santa Clara operation, a testament to Summit's ongoing commitment to cutting-edge technology and operational excellence.
Indium to Showcase Power Electronics Products at NEPCON Japan
01/14/2025 | Indium CorporationAs one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.
SolderKing to Highlight Innovations in Soldering and Manufacturing Efficiency at Southern Manufacturing & Electronics 2025
01/08/2025 | SolderKing Assembly Materials Ltd,SolderKing, a leading UK manufacturer of advanced soldering materials and consumables, will be exhibiting at the Southern Manufacturing and Electronics Show from 4-6 February 2025 at the Farnborough International Exhibition Centre, Stand J90.
Altus Highlights Heller Industries Advances in Void Reduction Under 1%
01/06/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, emphasises the importance of reducing voids in reflow soldering to improve manufacturing efficiency and product reliability
IPC Announces UK Regional Qualification for Hand Soldering Competition
01/02/2025 | IPCIPC invites skilled soldering experts to participate in the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) on February 4-6, 2025, at the Farnborough International Exhibition Centre.