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Voiding Control at High-Power Die-Attach Preform Soldering
May 17, 2017 | Dr. Arnab Dasgupta, Elaina Zito, and Dr. Ning-Cheng Lee, Indium CorporationEstimated reading time: 4 minutes
2. Voiding vs. Weight Analysis: The actual voiding data of SAC305 under various weights are presented in Figure 3 and Figure 4. Other than the 100-gram condition showing a wider voiding distribution, no clear trend can be concluded. The lack of an obvious trend could be attributed to data scattering. It might also be possible that weight may not be a direct governing parameter. Similar to all other liquids, liquid solder is expected to follow fluid dynamics, with a greater difficulty to have lamellar flow under a small clearance. Since voiding involves void coalescence and escaping, and a higher BLT will facilitate both, it makes sense to investigate voiding behavior around the bondline thickness. Figure 5 shows that with increasing weight, the BLT maintained constant around 0.18 mm at first, then decreased at a weight higher than 50 grams, and then reached 0.04 mm at 100 grams of weight.
Figure 2: Edge view of cross-sectioned samples under 30 grams of weight.
Figure 3: Actual voiding data of SAC305 under various weights.
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