-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC Hand Soldering Competition Winner Crowned at SMT Hybrid Packaging 2017
June 8, 2017 | IPCEstimated reading time: 1 minute
The competition was fierce as 34 competitors participated in the IPC’s Hand Soldering Competition at SMT Hybrid Packaging 2017 in Nuremberg, Germany. Taking first place and a cash prize of €300 was Elaine Chesnais, Thales International, who earned 433 points out of a possible 437. Chesnais was the second-place winner at SMT in 2016.
Second place and a cash prize of €200 this year went to Aurelie Buret, Thales International. Ekatarina Stahlmann, Grundig Business Systems, took third place and a cash prize of €100. Ekatarina Stahlman is not new to the IPC Hand Soldering Competition at SMT Hybrid Packaging Exhibition as she was the first-place winner in 2015 and 2016.
Participants in the hand soldering competition were tasked with building a functional electronics assembly, a new design this year, within a 60-minute time limit. Master Instructor Trainers Rob and Stefan Walls, PIEK, and Hubert Huffschmitt, IFTEC, served as independent judges and evaluated each assembly based on workmanship, overall functionality, compliance with IPC-A-610 Class 3 criteria and speed to complete the PCB.
"The best-of-the-best hand soldering talent in Europe came to compete at this event," said David Bergman, IPC vice president of international relations. "The competition was tough, but each competitor rose to the challenge. We look forward to hosting more hand soldering competition across the globe."
Bergman added, "IPC would like to thank hand soldering competition gold sponsors: JBC, Kurtz Ersa, and Weller; silver sponsors: Almit, Balver Zinn, and NCAB Group; bronze sponsor: Piek; IFTEC and ULT and contest contributors: Mircosolder for their support."
IPC is planning to hold additional hand soldering competitions in Europe, later this year in October and November. Watch for announcements from IPC with locations and times.
Suggested Items
TRI to Exhibit at SMTA Queretaro Expo 2025
07/16/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is pleased to announce plans to exhibit at the SMTA Querétaro Expo 2025, scheduled to take place on July 24, 2025, at the Querétaro Centro de Congresos y Teatro Metropolitano.
IPC Hall of Fame Spotlight Series: Highlighting Lionel Fullwood
07/15/2025 | Dan Feinberg, I-Connect007Many IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. This special series on IPC Hall of Fame members provides a reminder of who was honored and why. As a bonus, for those who are still around, we get to find out what these talented individuals are up to today.
TRI Unveils New Platform for Diverse Board Sizes
07/14/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces a new size configuration for SPI and AOI Models.
Seeing a Future in Mexico
07/09/2025 | Michelle Te, I-Connect007The Global Electronics Association (formerly known as IPC) has been instrumental in fostering a partnership with Guanajuato, a state north of Mexico City with 12 industrial clusters and close to 150 companies involved in electronics. This past spring, Alejandro Hernández, the undersecretary for investment promotion in Guanajuato, attended IPC APEX EXPO 2025 at the invitation of IPC Mexico Director Lorena Villanueva, where he met with several companies to discuss the opportunities available in Mexico. He is inviting electronics-related companies seeking long-term investment in a centrally located area with access to highways, railways, and ports.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.