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TRI Unveils New Platform for Diverse Board Sizes
July 14, 2025 | TRIEstimated reading time: Less than a minute

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces a new size configuration for SPI and AOI Models.
The new Size M configuration for selected Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) platforms provides manufacturers with greater flexibility for large-sized board applications, such as EV batteries, data center boards, and more.
The size M configuration has a board handling capability of up to 660 x 690 mm, the lineup includes the TR7007M SIII and TR7007MD/Q SII for SPI, and the TR7700MQ SII, TR7700M SIII Ultra, TR7500M SIII Ultra, and TR7700MQC SII for AOI.
TRI inspection solutions support current Smart Factory and communication standards such as SMEMA, SECS/GEM, IPC-CFX-2591, and IPC-HERMES-9852, ensuring a cost-effective, Industry 4.0-compliant solution for comprehensive defect detection and data exchange.
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Julia McCaffrey - NCAB GroupSuggested Items
PARMI Enhances Support for Brazilian Electronics Manufacturers with New Local Partnership
08/26/2025 | PARMI USAPARMI USA, INC., a leader in advanced 3D inspection systems, is pleased to announce the appointment of Prosperar Solutions, led by Henrique Dantas, Commercial Director, as its new representative in Brazil.
Datest Unveils Viscom iX7059 XL 3D CT AXI System
08/25/2025 | DatestDatest, a trusted leader in advanced testing, engineering, inspection, and failure analysis services, and the go-to destination for when your boards misbehave and your AXI line goes on vacation, is thrilled to announce the arrival of its newest diagnostic weapon: the Viscom iX7059 XL 3D CT AXI Inspection System.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/14/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.
TRI's Advanced WLP and Back-End Solutions at SEMICON Taiwan 2025
08/11/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 10 - 12, 2025.
TRI's Advanced WLP and Back-End Solutions at SEMICON Taiwan 2025
08/08/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 10 - 12, 2025.