New Technique Enables 3-D Printing with Paste of Silicone Particles in Water
June 8, 2017 | North Carolina State UniversityEstimated reading time: 1 minute
Using the principles behind the formation of sandcastles from wet sand, North Carolina State University researchers have achieved 3-D printing of flexible and porous silicone rubber structures through a new technique that combines water with solid and liquid forms of silicone into a pasty ink that can be fed through a 3-D printer. The finding could have biomedical applications and uses in soft robotics.
In a paper published today in Advanced Materials, corresponding author Orlin Velev and colleagues show that, in a water medium, liquid silicone rubber can be used to form bridges between tiny silicone rubber beads to link them together – much as a small amount of water can shape sand particles into sandcastles.
Interestingly, the technique can be used in a dry or a wet environment, suggesting that it has the potential to be used in live tissue – think of an ultraflexible mesh encapsulating a healing droplet, or a soft bandage that can be applied or even directly printed on some portion of the human body, for example.
“There is great interest in 3-D printing of silicone rubber, or PDMS, which has a number of useful properties,” said Velev, INVISTA Professor of Chemical and Biomolecular Engineering at NC State. “The challenge is that you generally need to rapidly heat the material or use special chemistry to cure it, which can be technically complex.
“Our method uses an extremely simple extrudable material that can be placed in a 3-D printer to directly prototype porous, flexible structures – even under water,” Velev added. “And it is all accomplished with a multiphasic system of just two materials – no special chemistry or expensive machinery is necessary. The ‘trick’ is that both the beads and the liquid that binds them are silicone, and thus make a very cohesive, stretchable and bendable material after shaping and curing.”
The paper is co-authored by first author Sangchul Roh, an NC State Ph.D. candidate; NC State graduate student Dishit Parekh; Bhuvnesh Bharti, a faculty member at Louisiana State University; and Dr. Simeon Stoyanov of Wageningen University in The Netherlands.
The research is funded by the National Science Foundation under grant CBET-1604116 and by the Research Triangle Materials Research Science and Engineering Center on Programmable Soft Matter under grant DMR-1121107. NC State has filed a provisional patent on the new technique.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.