Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

MacDermid Alpha Addresses Growing Demands for Electronics Reliability and Manufacturing Performance at Productronica India 2026

09/10/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will highlight advanced materials engineered to improve reliability, process consistency and performance in increasingly complex electronics applications at Productronica India 2026, September 16-18, at the Bangalore International Exhibition Centre in Bengaluru.

Teledyne Qioptiq Receives $21M+ Germany Order for PHOENIX-XR Thermal Sights

09/04/2026 | BUSINESS WIRE
Teledyne Technologies Incorporated announced that Teledyne Qioptiq has received the first option from the German Bundeswehr for PHOENIX-XR cooled weapons sights valued at more than $21 million.

Beyond the Chip: Indium Highlights AI Materials Solutions at SEMICON Taiwan 2026

09/04/2026 | Indium Corporation
As artificial intelligence (AI) and high-performance computing (HPC) continue to accelerate semiconductor innovation, the industry is moving beyond the challenge of building a more powerful chip. Increasingly complex packaging, higher power density, tighter thermal requirements, and demands for faster, more cost-effective manufacturing are making system-level performance and the broader manufacturing ecosystem critical to the next generation of AI.

Battalion Advanced Technology, Penn State Launch National Security Research Collaboration

09/02/2026 | PRNewswire
Penn State and Battalion Advanced Technology Ltd, have entered into two research agreements worth up to $6 million to develop advanced semiconductor platforms and high temperature materials that aim to enable next generation energy, transportation, aerospace and industrial systems while also providing critical capabilities for national security.

Indium to Highlight High-Reliability Solder, Low-Silver, and Thermal Management Solutions at Productronica India

09/02/2026 | Indium Corporation
With a team of manufacturing and technical experts supporting customers across India, Indium Corporation will feature its portfolio of high-performance solder pastes, lower-cost, low-silver solder alloys, and thermal interface materials solutions at Productronica India, September 16-18, in Bengaluru, India.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in