-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Stretchable Electronics: Near-Term Commercial Success Stories
June 13, 2017 | IDTechExEstimated reading time: 5 minutes

Stretchable electronics is a diverse umbrella term including numerous technologies, each targeting a different market, each having different technology readiness level, and each facing a different market prospect. In this article, we highlight one stretchable electronics technology with the potential to become a near-term success story: interconnects.
Stretchable interconnects
Connectors are a simple essential component in all electronic system. Their simplicity means that they can be made stretchable. This is in contrast to complex multi-layer interfacial devices like transistors whose stretchable versions are commercially years away despite numerous laboratory proof-of-concept results or prototypes. They are also essential. Indeed, they can even be the only stretchable component in stretchable systems made using the rigid island-stretchable interconnect approach.
A variety of approaches have been developed to produce stretchable interconnects. Some are shown in the figure below. In one approach, PCBs are made stretchable. Here, ICs and other rigid electronic components are mounded a standard PCB 'island'. These islands are then interconnected using a thinned meandering PBC lines, introducing stretchability. This technique is not yet easy to scale with good yields, but is also serving high-value low-volume applications.
In another approach, cables are arranged in a specific way to impart stretchability. One example is shown below. Here, stretching does not change the total length of the wire and thus causes no resistance change. Note that this approach often require introducing a separate distinct cable onto the e-textile systems, and whilst robust it is not structurally embedded. Note that conductive cables are themselves not intrinsically stretchable. Many approaches are however being developed, most at the early-stage prototyping level, to create truly stretchable conductive fibres/yarns. An example is shown here below. Here, carbon nanotubes were employed.
Approaches for achieving flexible interconnect. Left row top to bottom: stretchable PCB using meandering thinned lines; wires arranged in a stretchable configuration; intrinsically stretchable conductive fibres/yarns. Right row top to bottom: examples of stretchable inks on various substrates (Jujo Chemical, Toyobo, Nagase, Cemedine) and a stretchable printed ink-based electronic (Holst).
Conductive inks
Yet another approach is based on stretchable conductive inks. This approach enables the use of post-production processes steps such as transfer or screen printing to introduce the stretchable interconnect onto the textile. It therefore requires no alternation to standard textile production lines. It can also be used in stretchable circuits, particularly acting as stretchable interconnects on long stretchable substrates for use in, for example, medical electronics.
This approach is trendy all around the world: whilst only three years ago only two or three companies offered such inks, but now most players have either launched a product or demonstrated capability. The application pipeline is also gathering momentum with many products in late-stage prototyping phases and some even in the early commercial phase sales. Some examples are demonstrated below. For more information on the companies active in this field and emerging products/prototypes please refer to Stretchable and Conformal Electronics 2017-2027.
Examples of e-textile products or prototypes employing stretchable conductive inks. Sources: Holst Centre/DuPont (Wearable Expo Japan 2017), FEETME/DuPont (Wearable Expo Japan), Bebop impact sensors, Mimo breathing sensor, stretch sensor by Bainisha, activity sensors by Clothing +, Toyobo (Japan 2017), Jujo Chemical (FineTech 2016), Maxim Integrated, Toyobo (Japan 2017). The conference name/location indicates where each photograph was taken.
Stretchable conductive inks are still a young technology. Indeed, performance progress is highly visible when tracking the last few generations of inks launched by any given company in quick succession. Stretchable inks today can tolerate higher elongation levels and suffer less resistance change. These improvements have been achieved thanks to changes in resins, binders and even at times filler size distribution. See Stretchable and Conformal Electronics 2017-2027 for details on the performance levels of conductive inks under different conditions and by different suppliers.
There is still a long way to go though. Currently, the printed lines are encapsulated using a material such as TPU. This is not an elegant solution and the encapsulant is not ideal (e.g., issues with comfort, breathability, etc). Direct on-textile printing remains a long-term challenge as numerous textile substrates exist each with different properties and almost none offering a good printing surface.
Critically, the market requirements are yet fully known, and may even remain diverse and fragmented. For example, today suppliers receive enquiries for conductivity and stretchability levels at opposite ends of the performance spectrum. This is an opportunity for competent suppliers to offer customized solutions before slightly more standard product groups emerge. In fact, the ability to address varying cost-performance needs represents an opportunity for the entire category of ink-based stretchable interconnects compared to its rivals.
In-mold electronics
In addition to wearable and medical application, in-mold electronics (IME) applications are also emerging as a market for stretchable conductive inks. IME has previously got off to a false start, but, as stated in Stretchable and Conformal Electronics 2017-2027, we believe that its time has come. In IME, functional and graphical inks are printed on a flat sheet then formed into a 3D shape. Consequently, the inks will have to withstand at one-off elongation even (30-50% original length). Whilst similar to the previously-discussed stretchable inks, IME inks have different requirements: (a) they experience a one-off elongation, (b) they need to adhere well to the substrates used (e.g., polycarbonate), and (c) they must be compatible with the stack of other materials used in IME, e.g. layers graphical, insulating, transparent conducting, and other inks.
Here too, the industry has responded. Today, most suppliers have launched products or demonstrated capability. Today, many are engaged with major end users in either the automotive or while appliance industries. The trend is reflected in the increasing number of porotypes launched on the market (figure below shows some examples). In fact, in our ten-year market forecasts in Stretchable and Conformal Electronics 2017-2027, we expect success stories in the next two years.
Interestingly, the materials toolkit for this technology is expanding beyond conductive inks. For example, several stretchable transparent conductive film technologies have been developed, and some are close to product launches. This technology enable bringing capacitive touch technology to 3D-shaped surface in high-volume application. We will not discuss this development further in this article, but more detailed information on the technologies, applications and players can be found in Stretchable and Conformal Electronics 2017-2027.
About IDTechEx
IDTechEx guides your strategic business decisions through its Research and Events services, helping you profit from emerging technologies. We provide independent research, business intelligence and advice to companies across the value chain based on research activities and methodologies which provide data sought by business leaders, strategists and technology scouts to aid their critical business decisions.
Suggested Items
IPC Applauds Leadership of Reps. Moore and Krishnamoorthi on PCB Manufacturing Bill
05/28/2025 | IPCIPC, the global electronics association serving more than 1,400 U.S. companies and over 3,200 worldwide, strongly supports the bipartisan reintroduction of the Protecting Circuit Boards and Substrates (PCBS) Act in the 119th Congress.
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
05/27/2025 | Josh Casper -- Column: Smart AutomationArtificial Intelligence (AI) is rapidly becoming a staple in our personal and professional lives. In electronics manufacturing, integrating AI to combat common inefficiencies and to contextualize data will open new doors into how we supplement our traditional processes. In some specific areas of the electronics manufacturing process, integration of AI on the factory floor is already having a tremendous effect. One such area is PCBA inspection, particularly 3D automated optical inspection (AOI) systems.
Indium Promotes O’Leary to Director of Global Accounts
05/27/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to electronics, semiconductor, thin-film, and thermal management industries, announces the promotion of Brian O’Leary to Director of Global Accounts.
Promex Industries CEO Richard Otte Honored with IEEE Electronics Manufacturing Technology Award
05/27/2025 | PromexPromex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced that CEO Richard (Dick) Otte has received the 2025 Electronics Manufacturing Technology Award from the IEEE Electronics Packaging Society (EPS).
Robert C. Donovan Joins DISTRON, Marking the Third Generation in Family Leadership
05/26/2025 | Distron Corp.DISTRON CORPORATION, a leading U.S.-based electronics contract manufacturer, proudly announces that Robert C. Donovan, son of CEO Robert H. Donovan and grandson of Founder Robert G. Donovan, has joined the company as a Management Trainee. This milestone marks the beginning of the third generation of family leadership at the company.