The Marketing Minute: A Brand Visibility Playbook—Get Seen, Heard, and Remembered
American Made Advocacy: Supporting the Entire PCB Ecosystem—Materials to OEMs
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
Promex Industries CEO Richard Otte Honored with IEEE Electronics Manufacturing Technology Award
May 27, 2025 | PromexEstimated reading time: 1 minute
Promex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced that CEO Richard (Dick) Otte has received the 2025 Electronics Manufacturing Technology Award from the IEEE Electronics Packaging Society (EPS). The annual award recognizes individuals who have made impactful, sustained contributions to the field over 15 years or more, such as leading the development of major new processes in electronic manufacturing or significantly improving the yield or reliability of established processes.
“Our selection committee was very pleased to give this year’s award to Dick Otte,” said Dr. Patrick McCluskey, EPS program director, awards program. “His contributions are widely known and admired throughout our industry. From helping drive creation and advancement of the Heterogeneous Integration Roadmap, to heightening awareness of U.S.-based packaging and assembly capabilities, Dick has been a great champion for our sector and its importance for advanced electronics.”
Otte has dedicated more than five decades to advancing electronics packaging, shaping the industry with groundbreaking innovations. One of his earliest achievements was leading the development and introduction of multichip modules (MCMs) at Advanced Packaging Systems in the ’90s, laying the foundation for increasingly sophisticated packaging techniques. Building on that success, Otte continued pioneering methods for creating smaller, denser, and more complex assemblies that integrated semiconductor die alongside non-electronic components—an approach that marked the beginning of heterogeneous integration.
His contributions included supporting industry technical roadmaps: IEEE International Technology Roadmap for Semiconductors (ITRS), IEEE Heterogeneous Integration Roadmap (HI), and the iNEMI and International Photonic System Roadmaps (IPSR). The latter anticipated the integration of optical technologies to enhance data rates while reducing power consumption. Through his innovative work, Otte has contributed to advancements that have significantly improved the functionality, efficiency, and reliability of electronic devices across the medical, biotech, communications, and data processing industries—helping shape the future of smaller, smarter, and more dependable technology.
The award will be presented during the EPS Luncheon at the Electronic Components and Technology Conference (ECTC) in Dallas, Texas, on May 29, 2025.
Share on:
Suggested Items
NHanced Semiconductors VP Charles Woychik to Deliver Keynote at SMTA’s Symposium on Counterfeit Parts & Materials
06/18/2025 | NHanced SemiconductorsAt the upcoming SMTA Symposium on Counterfeit Parts & Materials, NHanced Semiconductors vice-president Dr. Charles Woychik will deliver a keynote address detailing the critical role of advanced packaging technologies needed to build a more resilient and advanced Outsourced Assembly and Test (OSAT) sector in the U.S. A strategic focus on advanced packaging technologies.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology
06/17/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case,
SEMI MEMS & Sensors Industry Group Invites Proposals for Funding Positioning, Navigation and Timing Technology Advancements
06/12/2025 | SEMIThe MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community, announced a Request for Proposals (RFP) for advanced technology development of positioning, navigation and timing (PNT) components and systems, including their manufacture. The full RFP document includes more information on the proposal submission process.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Mycronic’s Global Technologies Acquires Surfx in the US
06/03/2025 | MycronicMycronic’s Global Technologies division has acquired Surfx Technologies, a company headquartered in the US, providing atmospheric plasma solutions for surface treatment, including cleaning and active oxide removal.