Breakthrough Paves Way for Smaller Electronic Devices
June 14, 2017 | Queen’s University BelfastEstimated reading time: 3 minutes

Queen’s researchers have discovered a new way to create extremely thin electrically conducting sheets, which could revolutionise the tiny electronic devices that control everything from smart phones to banking and medical technology.
Through nanotechnology, physicists Dr Raymond McQuaid, Dr Amit Kumar and Professor Marty Gregg from Queen’s University’s School of Mathematics and Physics, have created unique 2D sheets, called domain walls, which exist within crystalline materials.
The sheets are almost as thin as the wonder-material graphene, at just a few atomic layers. However, they can do something that graphene can’t – they can appear, disappear or move around within the crystal, without permanently altering the crystal itself.
Smaller devices
This means that in future, even smaller electronic devices could be created, as electronic circuits could constantly reconfigure themselves to perform a number of tasks, rather than just having a sole function.
Professor Marty Gregg explains: “Almost all aspects of modern life such as communication, healthcare, finance and entertainment rely on microelectronic devices. The demand for more powerful, smaller technology keeps growing, meaning that the tiniest devices are now composed of just a few atoms – a tiny fraction of the width of human hair.”
“As things currently stand, it will become impossible to make these devices any smaller – we will simply run out of space. This is a huge problem for the computing industry and new, radical, disruptive technologies are needed. One solution is to make electronic circuits more ‘flexible’ so that they can exist at one moment for one purpose, but can be completely reconfigured the next moment for another purpose.”
The team’s findings, which have been published in Nature Communications, pave the way for a completely new way of data processing.
Etch-a-sketch
Professor Gregg says: “Our research suggests the possibility to “etch-a-sketch” nanoscale electrical connections, where patterns of electrically conducting wires can be drawn and then wiped away again as often as required.
“In this way, complete electronic circuits could be created and then dynamically reconfigured when needed to carry out a different role, overturning the paradigm that electronic circuits need be fixed components of hardware, typically designed with a dedicated purpose in mind.”
There are two key hurdles to overcome when creating these 2D sheets, long straight walls need to be created. These need to effectively conduct electricity and mimic the behavior of real metallic wires. It is also essential to be able to choose exactly where and when the domain walls appear and to reposition or delete them.
Solutions
Through the research, the Queen’s researchers have discovered some solutions to the hurdles. Their research proves that long conducting sheets can be created by squeezing the crystal at precisely the location they are required, using a targeted acupuncture-like approach with a sharp needle. The sheets can then be moved around within the crystal using applied electric fields to position them.
Dr Raymond McQuaid, a recently appointed lecturer in the School of Mathematics and Physics at Queen’s University, added: “Our team has demonstrated for the first time that copper-chlorine boracite crystals can have straight conducting walls that are hundreds of microns in length and yet only nanometres thick. The key is that, when a needle is pressed into the crystal surface, a jigsaw puzzle-like pattern of structural variants, called “domains”, develops around the contact point. The different pieces of the pattern fit together in a unique way with the result that the conducting walls are found along certain boundaries where they meet.
“We have also shown that these walls can then be moved using applied electric fields, therefore suggesting compatibility with more conventional voltage operated devices. Taken together, these two results are a promising sign for the potential use of conducting walls in reconfigurable nano-electronics.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.