Electronics Industry Pioneer Jim Raby Passes Away
June 19, 2017 | IPCEstimated reading time: Less than a minute

Long-time IPC member, industry leader and founder of STI Electronics Inc., Jim Raby, 82, passed away on Friday, June 16.
For more than 40 years, Jim worked on industry standards, including IPC-J-STD-001, IPC-A-610 and standards for wire harnesses. He was also involved in research for lead-free solder processes and materials. His seminal paper, “Standardization of Military Specifications,” was the roadmap for reducing some 219 specifications into a single four-document set known as MIL-STD-2000, the precursor to J-STD-001 and IPC-A-610.
He worked on more than a dozen standards and training programs, and chaired or vice-chaired committees on soldering, rework and repair, component mounting, and product assurance. He wrote the curriculum and conducted beta testing for IPC training programs for IPC-J-STD-001, IPC-A-610D, IPC/WHMA-A-620, and IPC-7711/7721A, and received the IPC Presidents Award in 1984.
Jim will be missed by his fellow IPC committee members, staff and his colleagues in the electronics manufacturing industry.
In a statement, the company said, "… Although Jim's passing will leave a huge void in each of our lives, his legacy will live on. His love for family, friends, colleagues and country will remain in our hearts and memories for years to come."
Funeral arrangements are pending.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.