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Semidynamics Releases Tensor Unit Efficiency data for its new All-In-One AI IP

06/25/2024 | Semidynamics
Semidynamics, the European RISC-V custom core AI specialist, has announced Tensor Unit efficiency data for its ‘All-In-One’ AI IP running a LlaMA-2 7B-parameter Large Language Model (LLM).

Beyond Prepreg: The Glassless ‘Revolution’

06/25/2024 | Marcy LaRont, PCB007 Magazine
As our industry rallies around the call to action for HDI and UHDI, we find unparalleled and myriad laminate options. This abundance is rivaled only by the question surrounding them: Can they measure up to the high technology packaging demands required in our near future? Unsurprisingly, recent developments in FR-4-esque materials for high-speed and high-density designs, as well as newer, glassless technology for replacing traditional glass-impregnated laminates and prepreg, are garnering much interest. I caught up with Alun Morgan, technology ambassador for Ventec International Group, to ask about the impending “glassless revolution” and how it’s poised to solve some of our manufacturing challenges.

Rheinmetall, Anduril Industries Join Forces to Develop the Most Sophisticated Military C-sUAS System

06/20/2024 | Rheinmetall
The Düsseldorf-based technology group Rheinmetall and the US company Anduril Industries signed a Memorandum of Understanding (MoU) during Eurosatory in Paris, one of the world's leading trade shows for defence and security.

Connect the Dots: Designing for Reality—Lamination and Materials

06/19/2024 | Matt Stevenson -- Column: Connect the Dots
As many of you have likely figured out, I am quite passionate about the subject of designing PCBs for the reality of manufacturing. I wrote a book about it and I participate in an I-Connect007 On the Line with… podcast series dedicated to the subject. This companion article will focus on multilayer lamination, keeping the bigger picture in mind: Realistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. So, one must account for the production variables associated with individual manufacturing partners.

Samsung Reportedly Achieves Technical Breakthrough, Stacking 3D DRAM to 16 Layers

06/05/2024 | PRNewswire
According to the news report from DIGITIMES Asia, Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron.
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