Research Accelerates Quest for Quicker, Longer-lasting Electronics
June 26, 2017 | University of California, RiversideEstimated reading time: 3 minutes

In the world of electronics, where the quest is always for smaller and faster units with infinite battery life, topological insulators (TI) have tantalizing potential.
In a paper published in “Science Advances,” Jing Shi, a professor of physics and astronomy at the University of California, Riverside, and colleagues at Massachusetts Institute of Technology (MIT), and Arizona State University report they have created a TI film just 25 atoms thick that adheres to an insulating magnetic film, creating a “heterostructure.” This heterostructure makes TI surfaces magnetic at room temperatures and higher, to above 400 Kelvin or more than 720 degrees Fahrenheit.
The surfaces of TI are only a few atoms thick and need little power to conduct electricity. If TI surfaces are made magnetic, current only flows along the edges of the devices, requiring even less energy. Thanks to this so-called quantum anomalous Hall effect, or QAHE, a TI device could be tiny and its batteries long lasting, Shi said.
Engineers love QAHE because it makes devices very robust, that is, hearty enough to stand up against defects or errors, so that a faulty application, for instance, doesn’t crash an entire operating system.
Topological insulators are the only materials right now that can achieve the coveted QAHE, but only after they are magnetized, and therein lies the problem: TI surfaces aren’t naturally magnetic.
Scientists have been able to achieve magnetism in TI by doping, i.e. introducing magnetic impurities to the material, which also made it less stable, Shi said. The doping allowed TI surfaces to demonstrate QAHE, but only at extremely low temperatures—a few hundredths of a degree in Kelvin above absolute zero, or about 459 degrees below zero Fahrenheit—not exactly conducive to wide popular use.
Many scientists blamed the doping for making QAHE occur only at very low temperatures, Shi said, which prompted researchers to start looking for another technique to make TI surfaces magnetic.
Enter UCR’s SHINES (Spins and Heat in Nanoscale Electronic Systems) lab, a Department of Energy-funded energy frontier research center at UCR that Shi leads and is focused on developing films, composites and other ways to harvest or use energy more efficiently from nano (think really small, as in molecular or atom-sized) technology.
In 2015, Shi’s lab first created heterostructures of magnetic films and one-atom-thick graphene materials by using a technique called laser molecular beam epitaxy. The same atomically flat magnetic insulator films are critical for both graphene and topological insulators.
“The materials have to be in intimate contact for TI to acquire magnetism,” Shi said. “If the surface is rough, there won’t be good contact. We’re good at making this magnetic film atomically flat, so no extra atoms are sticking out.”
UCR’s lab then sent the materials to its collaborators at MIT, who used molecular beam epitaxy to build 25 atomic TI layers on top of the magnetic sheets, creating the heterostructures, which were then sent back to UCR for device fabrication and measurements.
More research is needed to make TI show the quantum anomalous Hall effect (QAHE) at high temperatures, and then make the materials available for miniaturization in electronics, Shi said, but the SHINES lab findings show that by taking the heterostructures approach, TI surfaces can be made magnetic—and robust—at normal temperatures.
Making smaller, faster devices operate at the same or higher levels of efficiency as their larger, slower predecessors “doesn’t happen naturally,” Shi said. “Engineers work hard to make all the devices work the same way and it takes a lot of engineering to get there.”
UCR SHINES lab researcher Chi Tang is first author on the paper in “Science Advances,” along with co-first author Dr. Cui-Zu Chang, formerly of MIT, and now at Penn State University. The project also included several collaborators from UCR, MIT, Penn State and Arizona State University, Shi said.
Article by: Sarah Nightingale
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.