Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Fine Line Stencil and Metal Etching Technology to Merge
June 28, 2017 | BlueRing StencilsEstimated reading time: Less than a minute
Fine Line Stencil (FLS) and Metal Etching Technology (MET) Associates are merging to form a new company called BlueRing Stencils.
BlueRing Stencils will maintain eight manufacturing locations across the USA (Texas, New Jersey, New Hampshire, California, Florida, Indiana, Minnesota, and North Carolina).
Fred Cox of MET has been appointed president of BlueRing Stencils. “We look forward to providing improved technology and greater service to all of our stencil customers. Our combined companies will allow us to offer the latest innovations in SMT stencil printing,” he commented.
Brent Nolan of Fine Line Stencil said, “FLS and MET are a perfect match. We have different technical solutions that will now be combined. Additionally, our new geography will allow us to reach 90% of the demanding stencil market in one day using ground freight.”
BlueRing Stencils will provide laser cut and electroformed stencil solutions. They will offer NanoSlic Gold and Microshield coatings, EZ-Step laser welded steps, Mesh-Weld foil bonding, root cause analysis and CAD-matic software solutions, as well as other stencil printing technologies.
For more information, visit www.blueringstencils.com.
Share on:
Suggested Items
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.