-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Fine Line Stencil and Metal Etching Technology to Merge
June 28, 2017 | BlueRing StencilsEstimated reading time: Less than a minute
Fine Line Stencil (FLS) and Metal Etching Technology (MET) Associates are merging to form a new company called BlueRing Stencils.
BlueRing Stencils will maintain eight manufacturing locations across the USA (Texas, New Jersey, New Hampshire, California, Florida, Indiana, Minnesota, and North Carolina).
Fred Cox of MET has been appointed president of BlueRing Stencils. “We look forward to providing improved technology and greater service to all of our stencil customers. Our combined companies will allow us to offer the latest innovations in SMT stencil printing,” he commented.
Brent Nolan of Fine Line Stencil said, “FLS and MET are a perfect match. We have different technical solutions that will now be combined. Additionally, our new geography will allow us to reach 90% of the demanding stencil market in one day using ground freight.”
BlueRing Stencils will provide laser cut and electroformed stencil solutions. They will offer NanoSlic Gold and Microshield coatings, EZ-Step laser welded steps, Mesh-Weld foil bonding, root cause analysis and CAD-matic software solutions, as well as other stencil printing technologies.
For more information, visit www.blueringstencils.com.
Suggested Items
Hon Hai Research Institute Partners with Taiwan Academic Research Institute and KAUST to Participate in CLEO 2025
05/30/2025 | FoxconnThe research team of the Semiconductor Division of Hon Hai Research Institute, together with the research teams of National Taiwan University and King Abdullah University of Science and Technology in Saudi Arabia, has successfully made breakthroughs in multi-wavelength μ -LED technology to achieve high-speed visible light communication and optical interconnection between chips.
Meyer Burger Shuts Down Solar Module Production, Lays Off 282 Employees in the U.S.
05/30/2025 | Meyer BurgerMeyer Burger Technology AG is forced to stop its solar module production in the U.S., which is still ramping up, due to a lack of funds. On May 29, 2025, all 282 remaining employees at the Goodyear, Arizona, site received their notices of termination. Production with an annual capacity of 1.4 gigawatts was shut down immediately.
VJ Electronix Appoints Marco Cruz as Mexico Regional Sales Manager
05/30/2025 | VJ ElectronixVJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce the appointment of Marco Antonio Cruz Tovar as Mexico Regional Sales Manager.
Arrow Electronics Earns Dual Honors as Dell Technologies Partner of the Year
05/29/2025 | BUSINESS WIREGlobal technology solutions provider Arrow Electronics has received two prestigious awards from Dell Technologies: 2025 OEM Solutions Partner of the Year and 2025 North America Distributor of the Year. The awards were announced at Dell Technologies World, held in Las Vegas in late May.
Imec Unveils Record-Low Loss 300mm RF Silicon Interposer for Sub-THz Systems
05/27/2025 | ImecAt the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform.