Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Elma’s AI Optimized CompacFrame Speeds Development of Rugged GPU-focused Applications

05/05/2025 | Elma Electronic
Elma Electronic has expanded its line of SOSA aligned CompacFrame development chassis to include an AI (artificial intelligence) optimized 7-slot version.

'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025

05/02/2025 | TopLine
Braided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.

Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications

05/01/2025 | Cadence Design Systems
Cadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).

Elektrobit, Metoak Forge Strategic Partnership to Establish New Benchmark for Intelligent Driving Safety Ecosystem

04/29/2025 | Elektrobit
Elektrobit announced a comprehensive strategic partnership with Metoak, a leading Chinese provider of intelligent driving solutions.

Congatec Showcases High-performance Embedded Building Blocks at ElectroneX 2025

04/29/2025 | congatec
congatec, a leading vendor of embedded and edge computing technology, will present its latest high-performance hardware and software building blocks at ElectroneX 2025, taking place at the Melbourne Convention and Exhibition Centre from May 7-8.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in