Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
The Chemical Connection: Experience and Wisdom Gained by Doing Business
It's Only Common Sense: Leveraging AI in Your Sales Strategy
Flexible Circuit Technologies to Host Free Flex Heater Webinar
August 18, 2025 | Flexible Circuit TechnologiesEstimated reading time: 1 minute
Global supplier of flexible circuits, flex design services, and assembly/box-build services, Flexible Circuit Technology will host their latest webinar, "Thermal Precision Meets Flexibility: The Technology Behind Heater Circuits" on Tuesday, August 26th, 2025 at 11 AM EDT.
This flexible heater webinar will provide valuable insight into the 'why or why not' use of the latest innovations and practical applications of flexible heaters. Participants gain a deeper understanding of how flexible heaters are engineered, customized, and integrated into products across various industries including automotive, medical, aircraft, and consumer electronics. We will highlight real-world case studies and design considerations, helping attendees learn how to optimize performance, improve energy efficiency, and solve specific heating challenges in complex environments.
WEBINAR: August 26, 2025, 11 AM EDT (10 AM CST)
KEY TAKEAWAYS:
- Discover the benefits of flexible heaters for a variety of applications
- Explore the advantages and limitations of flexible heaters
- Understand design considerations for maximizing performance and durability
- Compare the merits of adhesive and resistive foil selections
- Examine the cost drivers of flexible heaters
SPEAKERS:
Mark Finstad, Director of Application Engineering, Flexible Circuit Technologies
Mark Finstad is an internationally recognized flexible circuit expert in design, fabrication and testing of flexible and rigid flex circuits offering more than 40 years of industry expertise. He is vice-chair of the IPC Flexible Circuits Committee, member of IPC Technical Activities Executive Committee (TAEC), Chairman of IPC-2223 Flexible Circuit Design Committee, and is an active member on the IPC-6013, IPC-4202, IPC-4203, and IPC-4204 committees. Finstad is a senior instructor on Flexible PCB design at IPC and PCB Design conferences. He is also an established columnist for Printed Circuit Design and Fab magazines and a featured writer for SMT, Connector Specifier, Machine Design, Medial Design and more.
Chris Clark, Senior Applications Engineer, Flexible Circuit Technologies
Chris Clark has more than 30 years of expertise to his customers as another of our highly experienced senior applications engineers. The breadth of his experience includes flex and rigid flex design, process engineering, project management, manufacturing and design for manufacturability. This broad range of experience allows Clark to take a design from concept to creation while avoiding pitfalls along the way. He also is a member of the IPC-2223, 6013, 4202 and 4204 committees.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area
08/28/2025 | Team NCAB -- Column: Fresh PCB ConceptsRigid-flex PCBs come in all shapes and sizes. Manufacturers typically use fire-retardant, grade 4 (FR-4) materials in the rigid section and flexible polyimide materials in the flex region. Because of the small size, some rigid-flex PCBs, like those for hearing aid devices, are among the most challenging to manufacture. However, regardless of its size, we should not neglect the transition area between the rigid and flexible material.
Global Flexible PCB Output Expected to Surpass $20 Billion by 2025, with AI Glasses Emerging as a New Growth Driver
08/25/2025 | TPCAThe Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute (ITRI) released the "2025 Global Flexible PCB Industry Outlook" in August.
Nano Silver Inks Market Forecast Report 2025-2030
08/20/2025 | Globe NewswireThe Nano Silver Inks Market is expected to grow from USD 427.415 million in 2025 to USD 836.160 million in 2030, at a CAGR of 14.36%.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.
OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
07/29/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has developed rigid-flex PCBs with embedded copper coins that offer improved heat dissipation for use in rockets and satellite-mounted equipment operating in vacuum environments.