A Slick Route to Smart Surfaces
July 3, 2017 | A*STAREstimated reading time: 2 minutes
The phenomenon of ‘dewetting’ — usually considered a nuisance as it causes solids to bead up into islands, much like raindrops on glass — has been harnessed for a useful application. An A*STAR-led team has clarified how dewetting can assemble arrays of 3D nanostructures for applications including single molecule sensing.
Solid state films freshly applied to microelectronic devices sometimes split apart at temperatures much lower than typical melting points, due to the high energy at the interface between the film and substrate. This dewetting effect is increasingly problematic at nanoscale film dimensions; however it has also inspired researchers looking for an easy way to produce patterned substrates.
Liangxing Lu from the A*STAR Institute of High Performance Computing and co-workers recently demonstrated that metal films can be transformed into ‘nano-aperture’ arrays — tiny pores with dimensions controllable down to 10 nanometers — by performing dewetting on surface templates containing 3D ridges and ripples. However, the team found that the templates only produced nano-apertures from metal films of a certain thickness; otherwise, random nanodot features appeared.
“Many factors influence the dewetting process, and also there are many types of equilibrium structures,” says Lu. “Finding the conditions for select morphologies is complex and difficult.”
To use dewetting for other nanostructure shapes, Lu and colleagues developed a custom algorithm to simulate solid state dewetting. Their technique calculates all possible nanopatterns for a dewetting film on a template and spots the lowest energy configuration. Then, diffusion calculations expose how movements between adjacent nano-islands lower the system’s total free energy.
“This model ignores the detailed kinetics, and instead analyzes the diffusion paths of equilibrium morphologies on a given substrate,” explains Lu. “The only driving forces are the surface and interface energies, which simplifies the problem.”
Through their calculations, the researchers produced detailed descriptions of droplet coalescence inside pit-shaped templates, and beading on top of table-like 'mesa' templates. Then, they generated phase diagrams that identified possible dewetting behavior on differently shaped templates — guidelines that proved useful for fabrication trials.
Collaborators at A*STAR’s Institute of Materials and Research Engineering verified this analytical approach by coating 100-nanometer high mesa templates with gold films, and then induced dewetting by heating the substrate. With electron microscopy images, they captured gold nanopatterns that matched their phase simulations, with only one exception: defects, such as grain boundaries, disrupted the natural dewetting patterns.
Lu believes that such fundamental fabrication insights could help optimize dewetting techniques for metallic interconnects and gratings, as well as the growth of special morphologies, such as nanowires.
Suggested Items
LG Innotek to Build FC-BGA into 700 Million USD Business with State-of-the-art Dream Factory
05/01/2025 | PR NewswireLG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the media for the first time and announced it on the 30th April.
Pioneering the Future of Substrate Manufacturing for North America
04/07/2025 | Marcy LaRont, I-Connect007In a rapidly evolving manufacturing landscape, the shift toward substrate technology has become a focal point for some companies in the PCB industry. Ralph Jacobo, technical sales and application engineer at all4-PCB, says all4-PCB has its roots in via-filling technology, has successfully navigated various market changes, and is now keenly focused on the demands of substrate manufacturing in North America. Ralph shares insights into the company's historical journey, current initiatives, and the innovative steps being taken to address the complexities of modern substrate processes.
MKS’ Atotech and ESI Participate in CPCA Show 2025
03/25/2025 | AtotechMKS Instruments, Inc., a global provider of enabling technologies that transform our world, today announced that its strategic brands ESI (laser systems) and Atotech (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at CPCA Show being held at National Exhibition and Convention Center from March 24-26, 2025.
Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai
03/24/2025 | DuPontDuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025.
INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation
03/11/2025 | iNEMIThe fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections.