-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current Issue
The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Proposed IEC Standard on Halogen-Free Raises Concerns
July 10, 2017 | IPCEstimated reading time: 1 minute
Like the game Whack-a-Mole, the idea of a standard for low-halogen electronics keeps popping up. Originally, proposed as an IPC specification of chlorine and bromine in copper-clad laminates, IEC 61249-2-21 was established many years ago to define FR-4 products for halogen-free.
Then about a decade ago, concerns about certain toxic bromine-containing flame-retardants (polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs) and concerns regarding incomplete combustion of PVC and bromine-containing plastics in electronics led to the passage of the EU WEEE Regulation and RoHS Directive which banned the toxic substances and mandated appropriate handling of waste electronics.
Despite the removal of any toxic halogen-containing compounds from the electronics supply chain, IPC and JEDEC members began discussions about the development of a standard for low halogen electronics. IPC, with its broad membership and open voting processes, never approved the low halogen standard, which was deemed to be a marketing tool posing as an environmental standard. JEDEC, with its narrower membership, went ahead and passed and published "Definition of 'Low Halogen' for Electronic Products” in 2015.
In 2016, the JEDEC standard was temporarily (up to six years) approved by IEC TC 111 (environmental standardization committee) as an IEC publicly available specification (PAS), despite the broad questions that were raised regarding technical validity. Revision and permanent adoption of the standard is now being considered by TC 111. The proposed revision would define electronics as “Low Halogen” when they “contain less than 0,9% (by mass) total elemental halogen content (F+Cl+Br+I) and meet the thresholds of all halogenated substances in IEC 91 62474 database." The proposed standard is concerning not just because of the content of the proposal, but by the labeling of low halogen as an environmental standard.
The standard is in the Committee Draft Phase which means it is being circulated for comments to all IEC TC111 member countries. The deadline for comment is September 15, 2017. If you are concerned, contact your country’s IEC National Committee and the IEC TC111 representatives.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.