-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Proposed IEC Standard on Halogen-Free Raises Concerns
July 10, 2017 | IPCEstimated reading time: 1 minute
Like the game Whack-a-Mole, the idea of a standard for low-halogen electronics keeps popping up. Originally, proposed as an IPC specification of chlorine and bromine in copper-clad laminates, IEC 61249-2-21 was established many years ago to define FR-4 products for halogen-free.
Then about a decade ago, concerns about certain toxic bromine-containing flame-retardants (polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs) and concerns regarding incomplete combustion of PVC and bromine-containing plastics in electronics led to the passage of the EU WEEE Regulation and RoHS Directive which banned the toxic substances and mandated appropriate handling of waste electronics.
Despite the removal of any toxic halogen-containing compounds from the electronics supply chain, IPC and JEDEC members began discussions about the development of a standard for low halogen electronics. IPC, with its broad membership and open voting processes, never approved the low halogen standard, which was deemed to be a marketing tool posing as an environmental standard. JEDEC, with its narrower membership, went ahead and passed and published "Definition of 'Low Halogen' for Electronic Products” in 2015.
In 2016, the JEDEC standard was temporarily (up to six years) approved by IEC TC 111 (environmental standardization committee) as an IEC publicly available specification (PAS), despite the broad questions that were raised regarding technical validity. Revision and permanent adoption of the standard is now being considered by TC 111. The proposed revision would define electronics as “Low Halogen” when they “contain less than 0,9% (by mass) total elemental halogen content (F+Cl+Br+I) and meet the thresholds of all halogenated substances in IEC 91 62474 database." The proposed standard is concerning not just because of the content of the proposal, but by the labeling of low halogen as an environmental standard.
The standard is in the Committee Draft Phase which means it is being circulated for comments to all IEC TC111 member countries. The deadline for comment is September 15, 2017. If you are concerned, contact your country’s IEC National Committee and the IEC TC111 representatives.
Suggested Items
Altus Break Records for Suppliers in 2025
01/20/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for electronics manufacturing, is pleased to announce record-breaking sales achievements for multiple supply partners in 2024.
PCB Market Expanding at 3.62% CAGR, To Reach $100 Billion by 2032
01/17/2025 | EINPresswire.comThe global Printed Circuit Board (PCB) Market was valued at US$72.63 billion in 2023 and is projected to exhibit steady growth over the coming years.
See You in Vienna: Speaker Spotlight on PEDC
01/16/2025 | I-Connect007 Editorial TeamVienna, Austria, is known for its amazing architecture, art museums, and classical music scene. But from now on, Vienna might also be known for its PCB design conference. IPC and FED have partnered to create a new PCB design conference in there. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30, 2025 at the NH Danube City hotel in Vienna.
DuPont Reaffirms Guidance, Accelerates Electronics Spin-off
01/16/2025 | PRNewswireDuPont announced the acceleration of the separation of its Electronics business and is now targeting November 1, 2025 to complete the transaction.
TRI to Join SMTA Austin Expo 2025
01/16/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is pleased to announce plans to exhibit at the SMTA Austin Expo 2025, scheduled to take place on February 6, 2025, at the Travis County Exposition Center.