BAE Systems Technology to Detect and Track Other Subs
July 18, 2017 | Business WireEstimated reading time: Less than a minute
The U.S. Defense Advanced Research Projects Agency (DARPA) has awarded BAE Systems a $4.6 million contract for its Mobile Offboard Clandestine Communications and Approach (MOCCA) program. The MOCCA program’s goal is to enable submarines to detect other submerged vessels at greater distances, while minimizing the risk of counter-detection.
“Advances in maritime technology are critical to the Department of Defense and an area where the U.S. military can continue to strengthen its advantage,” said Geoff Edelson, director of Maritime Systems and Technology at BAE Systems. “With the resurgence of near-peer competitors and an increasing number of submarines, MOCCA technology will provide Navy submariners with a vital asymmetrical advantage against a rapidly proliferating undersea threat.”
To meet the MOCCA program’s ambitious Phase 1 goals, BAE Systems’ researchers will design efficient sonar capabilities to maximize detection range and improve target identification and tracking.
The MOCCA program demonstrates BAE Systems’ strength in innovation and its capability to design technologies for future combat scenarios. The research and development team at BAE Systems regularly works closely with DARPA and other defense research institutes to create and deliver capabilities that improve the competitive advantages of the U.S. armed forces.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.
Indium Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain
04/28/2026 | Indium CorporationIndium Corporation announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) to develop a domestic process for recovering high-purity gallium from manufacturing by-products—a critical step toward establishing a secure, domestic supply chain for a material essential to modern defense systems, semiconductors, and advanced electronics.
Roundtable: Advanced Materials
04/27/2026 | I-Connect007 Editorial TeamDriven largely by the need for advanced chip technology for super compute ability and AI applications, low Dk, low-loss resin systems, and heavy copper laminate are attracting significant attention and global resources. There are numerous unavoidable challenges in this market that will impact manufacturers and the supply chain, and they may be hitting critical mass sooner than OEMs and fabricators think. In this roundtable discussion, moderator Marcy LaRont speaks with topic experts: Mark Goodwin, John Fix, and Ed Kelley.
Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains
04/22/2026 | PRNewswireSilicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles.