It’s Only Common Sense: The Importance of Setting Realistic Expectations
Marcy’s Musings: The Relentless Pursuit of Perfection
Dan’s Biz Bookshelf: ‘Do/Start'
High-Frequency Chip Brings Researchers Closer to Next Generation Technology
August 25, 2017 | UC DavisEstimated reading time: 1 minute
A novel, high-frequency electronic chip potentially capable of transmitting tens of gigabits of data per second — a rate that is orders of magnitude above the fastest internet speeds available today — has been developed by engineers at the University of California, Davis.
Omeed Momeni, an assistant professor of electrical and computer engineering at UC Davis, and doctoral student Hossein Jalili designed the chip using a phased array antenna system. Phased array systems funnel the energy from multiple sources into a single beam that can be narrowly steered and directed to a specific location.
“Phased arrays are pretty difficult to create, especially at higher frequencies,” Momeni said. “We are the first to achieve this much bandwidth at this frequency.”
The chip prototyped by Momeni and Jalili successfully operates at 370 GHz with 52 GHz of bandwidth. For comparison, FM radio waves broadcast between 87.5 and 108 MHz; 4G and LTE cellular networks generally function between 800 MHz and 2.6 GHz with up to 20 MHz of bandwidth.
Most modern electronics are designed to operate at lower frequencies. However, the growing demand for faster communication, and new and emerging applications of sensing and imaging are driving the creation of technologies that function at higher frequencies.
Reaching speed limit of 4G networks
“Theoretically, 4G cellular networks have reached their data rate limit,” Momeni said. “As we continue to migrate to systems like cloud computing and next generation cellular networks, the need for speed is growing. Higher frequencies mean more bandwidth and more bandwidth means higher data rate.”
The tiny piece of hardware designed by Momeni and Jalili is evidence that it is possible to harness the large available bandwidth at millimeter-wave and terahertz bands on a single, compact chip. This is an important step toward the development of scalable systems that can be used to sharpen technologies like spectroscopy, sensing, radar, medical imaging and high-speed communication.
In future work, Momeni plans to integrate the chip into imaging and communication systems.
Share on:
Suggested Items
AI Boom Drives Surge in Data Center Interconnect Demand; Global Market Value to Grow 14.3% in 2025
05/19/2025 | TrendForceTrendForce reports that leading global telecom providers such as SK Telecom and Deutsche Telekom are rolling out Agentic AI services for general users as generative AI becomes increasingly integrated into daily life in 2025.
FTG Achieves Major Milestone with TCCA Certification for Edge+ on Boeing 737NG Family
05/16/2025 | Globe NewswireFiran Technology Group Corporation (FTG) announced that its FLYHT subsidiary has been awarded a Supplemental Type Certificate (STC) by Transport Canada Civil Aviation (TCCA) for the AFIRS Edge+™ product on the Boeing 737NG family of aircraft.
Future-proofing Electronics: ChemFORWARD Works Toward Collaboration for Safer Chemistry
05/19/2025 | Rachel Simon, ChemFORWARDThe electronics industry is facing a critical juncture. As consumer demand for sustainable products rises and regulatory pressures intensify, companies must prioritize the safety of their products and processes. This means not only complying with evolving chemical restrictions but also proactively seeking safer alternatives.
Corning Collaborates with Broadcom to Accelerate AI Data Center Processing Capacity
05/14/2025 | BUSINESS WIRECorning Incorporated, a world leader in glass science and optical physics, today announced a collaboration with Broadcom Incorporated, a leading supplier in the semiconductor field, on a co-packaged optics (CPO) infrastructure that will significantly increase processing capacity within data centers.
Breaking Down Barriers: The Connectivity of Machines in SMT Production Lines
05/14/2025 | Bill Cardoso, Creative ElectronAs the world increasingly moves toward erecting trade barriers, we find ourselves in a paradox. Across the globe, the rise in tariffs and protectionist policies is creating a more fragmented global economy, with nations seeking to insulate themselves from external economic pressures. However, within the confines of the SMT production line, the trend is moving in precisely the opposite direction—toward greater connectivity, integration, and collaboration. Rather than isolating one machine from another, SMT production lines are increasingly interconnected, with data being shared across various stages of the process to improve quality, efficiency, and defect detection.