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Advanced Electronics Packaging Digest

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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/22/2026 | Nolan Johnson, I-Connect007
It’s been a busy week in the news. I could legitimately have published another five items because there were so many meaningful topics. So, I start with attorney James Kim, who returns to update us on metals tariffs. Brian Chislea and Cody Schoener from Dow recently published a book on UV curable conformal coatings. The Taiwan Printed Circuit Association has launched a PCB-specific AI knowledge base. SEMI FlexTech is seeking proposals for advancing flexible hybrid technologies, and the Global Electronics Association has launched the Global Electronics Policy Council, unifying its advocacy voices.

Renesas Completes Acquisition of Irida Labs

05/07/2026 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that a subsidiary of Renesas has completed the acquisition of Irida Labs, a Greece-based company specializing in embedded software for AI-powered visual perception systems.

Northrop Grumman Honors Top Suppliers Driving Industrial Innovation

05/04/2026 | Northrop Grumman
Northrop Grumman Corporation continues to build on its spirit of innovation, honoring suppliers who are critical partners in advancing the defense industrial base for the U.S. and its allies.

EdgeCortix Secures Investment from Axiro Semiconductor, MPower Partners for Edge AI

04/15/2026 | BUSINESS WIRE
EdgeCortix, a leading fabless semiconductor company specializing in energy-efficient AI processing at the edge, announced a new investment from Axiro Semiconductor Pvt. Ltd., a wholly owned subsidiary of CG Power and Industrial Solutions, and MPower Partners, a Japan-based global venture capital fund, building on the strong momentum of its previously oversubscribed funding round.

Celestica, AMD Announce Collaboration to Advance the Next Era of AI with 'Helios' Rack-Scale AI Platform

03/19/2026 | Celestica
Celestica Inc., a global leader in data center infrastructure and advanced technology solutions, and AMD, a leader in high-performance and AI computing, announced a strategic collaboration to bring the new “Helios” rack-scale AI platform to market.
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