-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Universal Highlights Uflex at SMTA International
September 13, 2017 | Universal InstrumentsEstimated reading time: 2 minutes

Universal Instruments will feature the ultra-flexible Uflex platform – one solution in an extensive automation lineup that addresses virtually every automation challenge – on Booth 223 at the SMTA International trade show in Rosemont, Illinois, on September 19–20. Universal will also have experts from its renowned Advanced Process Lab (APL) on the booth to share insights on current and emerging technologies and help visitors optimize their manufacturing operations.
Uflex delivers cost-effective automation by quickly transitioning to a comprehensive array of standard and third-party tooling, as well as numerous feeding options, to perform virtually any automation task. It features simplified, icon-based programming that can be performed at a manufacturing-level, rather than at the engineering level. These advantages can dramatically speed time to market, particularly in high-mix environments. Uflex provides investment protection versus custom cells designed for a single task, and can lower the cost per insertion by more than 95% versus manual assembly process while substantially improving quality and yields.
On Thursday, September 21 – the final day of the Technical Conference – the APL’s AREA Consortium will cochair Session LF1 in the Lead-Free Soldering Symposium. The full session features three individual papers which summarize the AREA Consortium’s ongoing research on lead-free technology and, in particular, its effects on long-term reliability. These include: Thermal Cycle Reliability Assessment of Bowed PCB Assemblies, The Effect of Die Size on the Thermal Fatigue Reliability and Failure Mode of a Chip Array BGA, and Effect of Process Thermal History on the Microstructure of Copper Pillar SnAg Solder Joints. The papers will be presented by the AREA Consortium and various Consortium members.
“SMTAi is a show that continues to grow, with a 10% increase in booth space and more than 170 exhibiting companies last year,” said Jeff Knight, APL General Manager. “This is really the premier show of the year for the APL. The Technical Conference is one of the strongest in the industry and we’ve built many lasting relationships with customers that we’ve met at the Exhibition over the years.”
About Universal Instruments
Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. Universal Instruments delivers comprehensive solutions to a global customer base by leveraging exclusive process expertise combined with its innovative portfolio of flexible platforms for surface mount, insertion mount, advanced semiconductor packaging, and end-of-line automation. Universal Instruments is headquartered in Binghamton, N.Y., USA, with offices in Europe, Asia, and the Americas.
Suggested Items
Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
03/10/2025 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Indium Experts to Present on Solder and Thermal Solutions at APEX 2025
03/07/2025 | Indium CorporationAs a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
Black Diamond Orders Hentec Industries/RPS Automation Vector 300 with EMP Upgrade
03/03/2025 | Hentec Industries/RPS AutomationThe Vector 300 is the most compact model in the selective soldering Vector series lineup, making it ideal for facilities with limited space. Despite its size, the Vector 300 can process boards up to 300 x 300 mm (11.8 x 11.8 in.).
Technica USA and Electra Polymers: Driving Success in Ink Jet Solder Mask Across North America
02/27/2025 | Technica USATechnica and Electra Polymers have achieved remarkable success in the ink jet solder mask market. Electra Polymers is the dominant force in North America, holding an overwhelming market share north of 80% with its ElectraJet® EMJ110 solder mask.