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SHENMAO Addresses HoP Issues, Improves ICT Testability
September 13, 2017 | SHENMAO America Inc.Estimated reading time: 1 minute
SHENMAO Technology Inc. will introduces its new generation PF606-P140 lead-free solder paste and PF606-P245 lead-free zero-halogen solder paste at the upcoming SMTA International Exhibition, to be held September 19–20, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois. SHENMAO will be in Booth 534.
Featuring superior continuous high-speed printability and a wide reflow process window for excellent solderability, the PF606-P140 and PF606-P245 prevent head-on-pillow (HoP) issues and can easily fit into highly complicated PCB designs through excellent convergence performance. The PF606-P140 features void performance at 3.7%, while the PF606-P245, 5.5%.
The PF606-P140 and PF606-P245 improve ICT testability with flux completely removed from top of solder to prevent contamination of test pins during test operation. Minimal flux residue gathers near outside of solder joint on the PCB substrate, a substantial improvement over legacy solder pastes.
About SHENMAO
For more than 44 years, SHENMAO has been dedicated to produce solder products including water soluble and no-clean solder paste, laser solder paste, solder preforms, cored solder wire, wave solder bar alloys, wave soldering fluxes, extremely pure solder powder up to Type 8, BGA and micro-BGA solder sphere, wafer level packaging solder paste and fluxes, LED die attach paste, high performance liquid fluxes, solder preform, solar ribbon, and plating anode used in PCB fabrication, assembly and semiconductor packaging processes.
SHENMAO solder materials are available at affordable cost from 10 worldwide locations.
For more information, visit www.shenmao.com.
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