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MacDermid Enthone Electronics Solutions Launches MacuSpec AVF 700 Process
September 14, 2017 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, announces the release of the MacuSpec AVF 700 process, a high performance electrolytic copper metallization for the filling of microvias in printed circuit boards. AVF 700 allows for the removal of conventional process steps such as flash plate, microetch, and predip, while providing a stronger direct copper-to-copper bond for enhanced reliability of vias. With AVF 700 customers get all of this with a very low amount of surface copper plating, requring little to no post processing thickness reduction.
Bill Bowerman, Director of Metallization, MacDermid Enthone, noted, “The release of MacuSpec AVF 700 further demonstrates MacDermid Enthone Electronics Solutions’ commitment to offering the most extensive and highest performing metallization process portfolio available in the electronics manufacturing industry today. Combined with our industry leading direct metallization solutions we can completely revolutionize customers’ bottom lines through cost savings, environmental benefits, and improved performance and reliability. MacuSpec AVF 700 is the advanced via fill choice for 'Anylayer' HDI designs and MacDermid Enthone is the only company that can achieve this unique value proposition.”
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. Click here for more information.
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