-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
The Root Causes & Solutions for Warped PC Boards
September 27, 2017 | Duane Benson, Screaming CircuitsEstimated reading time: 2 minutes

So, you just got a nice big PCB back from the fab shop. You set one on your desk to admire, only to discover that it's warped. What do you do?
There are two primary types of causes of board warping: process related at the fab or assembly shop, and layout related issues.
If it's warped before assembly, it's between fab and layout. If it's flat before assembly and warped after, it's most likely between layout and assembly. That said, sometimes a fab problem won't show up until a pass through the reflow oven at your assembly partner.
Determining the root cause is generally a bit of an iterative process. It's tempting to start right off with your fab or assembly partner, but you need some information before giving them a call. You'll need such things as the amount of warpage per inch, board size and thickness. With that, you need to take a good look at your design and consider copper pours, component size and component placement.
With that information in hand, you can make your phone call. If the board is warped before assembly, call your fab shop. If it's flat pre-assembly and warped post assembly, call your assembly house.
The shop you call will want to talk over your design to help you pinpoint the cause. If you can rule out a design issue, then you need to talk with your partner to determine whether it's a fab or assembly issue, and the next steps to take care of you.
Here are a few design issues that could contribute to warping:
- Uneven copper pour: Copper and FR-4 are a good match relative to thermal expansion, but they aren't exact. A large pour on one side or corner of your board can lead to warping due to dissimilar expansion characteristics. This could cause warpage either at the fab shop or the assembly house.
- Thermal mass: Components with large thermal mass grouped together on the board. This would be more likely to cause problems during assembly than during fab. The thermal mass will act as a heat sink for that area on the board, which can lead to uneven expansion and uneven soldering.
- Thin boards: A board that's too thin for the size or number of components could lead to warping at any stage.
- Irregular shapes: Odd shapes or large cutouts could also lead to warping at any point.
There may be other, more obscure causes, but those are the main design related causes. If it's none of those, talk with your partner. Occasionally, design requirements lead to a board that is essentially non-manufacturable. Hopefully, you never have this situation, but if you do, make sure that thickness, component location, pours, or cut outs really need to be the way they are.
If you absolutely, positively can't change anything, go back and try again. Then you can to look for heroic means to get the board fabricated and built. Slight warpage might go away when the board is mounted. Just be careful. Some components may not stay securely soldered when you flatten it.
The board may need a special fixture during assembly to prevent warping. This will likely cost extra, but if you can't change your design, and still need it built, it may be your best option.
Finally, if nothing works, you may need to look harder at the design, or look for a new fab or assembly house. We all like to think we can do just about anything, but every shop has its limits, and on rare occasion, those limits can be difficult to spot.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.