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Fujifilm to Invest 4 Billion yen in Belgium for CMP Slurries and Photolithography-related Materials

02/07/2025 | Fujifilm
FUJIFILM Corporation today announced that it will install new production facilities of CMP slurries*1, advanced semiconductor materials, and enhance existing facilities for photolithography-related materials*2 at its production site located in Belgium. In Europe, where demand for automotive semiconductors and industrial semiconductors supporting the DX of manufacturing processes at factories is expected to grow, Fujifilm makes an investment of approximately 4 billion yen (approx. 25 million EUR) to expand the production capacity of its Belgium site, based in Zwijndrecht, Antwerp.

Indium Expert to Address Thermal Challenges at TestConX 2025

02/04/2025 | Indium Corporation
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.

3M Joins Consortium to Accelerate Semiconductor Technology in the U.S.

02/04/2025 | PR Newswire
3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers. The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley.

Happy’s Tech Talk #37: New Ultra HDI Materials

02/03/2025 | Happy Holden -- Column: Happy’s Tech Talk
Some new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)

The Future of Electronics Manufacturing in APAC

01/30/2025 | Daniel Schmidt, MKS' ATOTECH
The Asia-Pacific (APAC) region is solidifying its leadership in electronics manufacturing, fueled by significant new investments from global industry leaders. This growth is driven by surging demand for high-performance components in key sectors like AI, autonomous vehicles, and sustainable energy, making strategic innovation in semiconductors and advanced electronics essential. APAC's strong supply chains further enhance its appeal to investors.
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