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Advanced Electronics Packaging Digest

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Teledyne MEMS Expands Edmonton Operations with Support from Government of Alberta

06/25/2026 | BUSINESS WIRE
Teledyne MEMS is expanding its manufacturing operations in Edmonton with support from the Government of Alberta, reinforcing the province’s growing role in the global semiconductor supply chain and creating new, high-skill jobs.

Nokia Announces Major Expansion of U.S. Semiconductor Advanced Test and Packaging in Pennsylvania to Bolster AI Growth

06/24/2026 | Nokia
Nokia announced a major expansion of its advanced test and packaging (ATP) operations in Allentown, Pennsylvania. The investment will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity across the United States.

Gov. Hochul, TTM Technologies Mark Opening of $130M Manufacturing Facility in Dewitt

06/24/2026 | New York State Government
Governor Kathy Hochul announced the completion of TTM Technologies, Inc.’s new manufacturing facility located in Central New York. A leading global manufacturer of technology solutions, the company’s new state-of-the-art manufacturing facility is co-located on approximately 23 acres adjacent to TTM’s existing production facility in the Town of DeWitt, Onondaga County.

Automation as a Survival Strategy

06/24/2026 | Marcy LaRont, I-Connect007
At the EIPC Summer Conference, Aurelijus Beleckis, head of robotics at Lithuania-based Elinta Robotics, challenged manufacturers to rethink how they evaluate automation investments. Elinta has been growing its robotics business for 10 years and is the leading Lithuanian company in this market.

TTM Technologies Opens Ultra-HDI Manufacturing Facility in Syracuse, NY

06/23/2026 | TTM Technologies
TTM Technologies, Inc., a leading U.S. manufacturer of advanced electronics and interconnect solutions for aerospace, defense, and high-technology markets, today celebrated the ribbon-cutting and grand opening of its new Ultra-High-Density Interconnect (Ultra-HDI) printed circuit board (PCB) manufacturing facility in Syracuse, New York — marking a significant investment in domestic defense electronics manufacturing.
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