Celestica Honors Avnet with Best Aerospace and Defense Partner Award
October 4, 2017 | AvnetEstimated reading time: 1 minute
Avnet has been awarded a 2016 Total Cost of Ownership (TCOO) Supplier Award from Celestica, a leader in design, manufacturing and supply chain solutions for the world's most innovative companies. Celestica's awards program recognizes suppliers that provide the best TCOO performance to Celestica and support the company's overall business objectives.
"Avnet is proud to be recognized by Celestica," said Tom McCartney, senior vice president, global and strategic accounts, Avnet. "The ongoing success of Avnet's engagement with Celestica demonstrates how critical a strategic and collaborative supply chain ecosystem is for organizations that seek to drive innovation, while still maintaining the efficiency and flexibility that are so essential in today’s high-tech sector. In today’s competitive landscape, Avnet will continue to leverage our unique global scale and best-in-class design and supply chain resources to help our valued customer, Celestica, generate the differentiated solutions needed to achieve its targets for robust growth and long-term profitability."
Celestica's TCOO Supplier Awards program evaluates and recognizes the top performers in Celestica's global network of over 4,000 suppliers. Celestica's TCOO system is focused on evaluating supplier performance by measuring the total cost to produce, deliver and support products and services beyond the supplier invoice price. As such, it considers the following supplier attributes: quality, delivery, price, flexibility, innovation and technology.
"Congratulations to Avnet for being recognized as the 'Best Aerospace and Defense Partner' in Celestica's supplier awards program," said Paul Blom, Chief Procurement Officer, Celestica. "Avnet has been consistent, flexible and proactive in their support of Celestica's Aerospace and Defense business, enabling us to reduce our lead times and be more responsive to our customers."
Suggested Items
Moog Announces Acquisition of COTSWORKS
07/07/2025 | BUSINESS WIREMoog Inc., a worldwide designer, manufacturer and systems integrator of high-performance precision motion and fluid controls and control systems, announced the acquisition of COTSWORKS Inc., an aerospace and defense fiber optics transceiver component manufacturer, for a purchase price of $63 million.
S&K Aerospace Awarded Major Contract Under DLA Maritime Acquisition Advancement Program
07/02/2025 | BUSINESS WIRES&K Aerospace, LLC has been awarded a significant contract under the Defense Logistics Agency’s (DLA) Maritime Acquisition Advancement Program, managed by the U.S. Naval Supply Command - Weapon Systems Support (NAVSUP WSS) in Mechanicsburg, PA.
Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
07/02/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 2025 SMD Symposium, taking place August 5-7 at the Von Braun Center in Huntsville, Alabama.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.