Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Strong Demand for HANZA's MIG Advisory Service Driving More Strategic Manufacturing Partnerships

11/29/2024 | HANZA
HANZA, a leader in manufacturing solutions, continues to reap success with its advisory service within its overall concept MIG™ (Manufacturing solutions for Increased Growth and earnings).

CIMS to Showcase Advanced Solutions at HKPCA 2024

11/29/2024 | CIMS
CIMS, a leader in inspection solutions for the electronics manufacturing industry, will participate in the Hong Kong Printed Circuit Association (HKPCA) Show 2024.

SIA Applauds Finalization of CHIPS Investments for Intel Manufacturing Projects

11/29/2024 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer praising finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and Intel Corporation.

The ICAPE Group Invests in Jiva Materials to Drive Eco-Friendly PCB Innovation in Europe

11/27/2024 | BUSINESS WIRE
ICAPE Group, a global technology distributor of printed circuit boards (“PCB”) and custom-made electromechanical parts, today announced it will be acquiring a minority shareholding in Jiva Materials Ltd, a UK-based innovator and the developer of Soluboard® - the world’s first fully biodegradable PCB substrate.

Biden-Harris Administration: CHIPS Incentives Award with Intel to Advance U.S. Leading-Edge Chip Capacity

11/27/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Intel Corporation up to $7.865 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award follows the previously signed preliminary memorandum of terms, announced on March 20, 2024, and the completion of the Department’s due diligence.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in