-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Viscom to Exhibit Latest 3D AOI and AXI Solutions at productronica 2017
October 12, 2017 | Viscom AGEstimated reading time: 2 minutes

Viscom AG will present its cutting-edge solutions for optical inspection systems with 3D technology under the motto "Solutions for me" at the upcoming productronica 2017 event in Munich, Germany, from November 14–17, 2017.
Close cooperation with customers and Viscom's decades of expertise have resulted in products that convince with very fast handling, excellent inspection results and the simplest operation. The new developments are focused on the challenges arising from increasing product changes and higher production volumes, miniaturization and Industry 4.0.
The highlight of the event for Viscom is the X7056-II automatic 3D X-ray inspection system, developed with extremely high throughput and superb image quality for the requirements in high-end electronics production. This new AXI in-line system can ensure precise inspection of hidden solder joints and components in high-volume production. It is equipped with the xFastFlow transport module, which cuts PCB changing times. With this feature, up to three boards can be processed at the same time. The new handling design also means that significantly larger board sizes can be inspected and the scope of angled radiation is extended.
Yet another compelling point is the extraordinarily versatile 3D AOI system range: from the premium solution S3088 ultra gold with brilliant image quality, 121 Mpixel resolution and unparalleled defect detection, to the high-performance S3088 ultra chrome for especially high throughput. All of Viscoms’s 3D systems are based on a combination of intelligent software and an optimum camera concept, so that components and solder joints can be measured in 3D. The result is even more explicit defect identification and fewer false calls, resulting in sustainable quality assurance.
Thanks to the revolutionary vVision operating software, inspection programs for new components and component groups are easily created within the shortest time. Because of a modern graphical user interface and numerous practical functions with user-friendly basic settings, operation is very intuitive. This is Viscom's answer to the requirements facing medium-sized companies in particular: small lot sizes, more frequent production changes, component miniaturization and efficient personnel deployment.
Viscom also meets the demand for major global enterprises to integrate their inspection systems into Industry 4.0 process lines – networking systems and master computers in different standards is possible. Within the context of big data, the Viscom systems furnish large volumes of information for external evaluations.
Visitors also can gain insight into Viscom’s expertise and know-how in two presentations: in the PCB & EMS Speakers Corner regarding the topic "How Big Data in Electronic Assembly Inspection Shortens Time-to-Market" and in the SMT Speakers Corner about "Process Control and Highest Quality beyond Optical and X-Ray Inspection".
Additional 3D AOI systems from Viscom also will be part of the Panasonic and Nokia trade fair exhibitions at their respective stands.
About Viscom
Viscom AG develops, manufactures and sells high-quality inspection systems. The portfolio encompasses the complete bandwidth of optical and X-ray inspections. In the area of assembly inspection for electronics manufacturing, the company is among the leading suppliers worldwide. Viscom systems can be configured specifically to the customer and can be interlinked. The company headquarters and manufacturing location is in Hanover, Germany. With a wide network of branches, applications centers, service support points and representatives, Viscom is represented internationally. Founded in 1984, since 2006 Viscom has been listed on the Frankfurt Stock Exchange (ISIN: DE0007846867). For additional information, click here.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.