-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
EIPC SpeedNews: News from the European PCB Industry
October 12, 2017 | EIPCEstimated reading time: Less than a minute
- Kingwong Seeks European Sales & Engineer Manager
- FED feiert 25-jähriges Jubiläum in Berlin: Digitalisierung im Fokus
- Smart Systems Integration 2018: Deadline for Abstract Submission Extended
- Elmatica COO Raymond Goh Increases His Responsibilities in the Company
- Seica SpA to Exhibit at productronica 2017
- ICT Evening Seminar at the Majestic Hotel, Harrogate, on December 5, 2017
- Polar Instruments News
- Smart Group: BGA, QFN Fine Pitch Rework Experience Live
- IMAPS-UK presents RELPACK 2017
Suggested Items
Winners of IPC Hand Soldering and Rework Competition Vietnam 2024 Announced
09/19/2024 | IPCIn conjunction with NEPCON Vietnam 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam, September 11-13. Thirty-nine competitors from 16 electronics companies and one university in Vietnam vied for top honors.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 4
09/11/2024 | I-Connect007 Editorial TeamIn this chapter, readers will learn the importance of efficiency in post-SMT processes such as rework and testing. Key KPIs are discussed, along with the need to reduce rework time, improve first-pass yield, maintain testers, and monitor defect rates. By optimizing these processes, manufacturers can enhance product quality, reduce costs associated with defects, and ensure customer satisfaction.
Winners of the IPC Hand Soldering and Rework Competition Malaysia at Electronics Manufacturing Expo Asia (EMAX) 2024 Announced
07/29/2024 | IPCIn conjunction with Electronics Manufacturing Expo Asia (EMAX) 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Penang, Malaysia July 24-26, 2024. The competition welcomed 36 contestants from 14 well-known electronics companies, and one institution in Malaysia.
Winners of 2024 IPC Masters Competition China Announced
07/17/2024 | IPCFrom July 8-10, the 2024 IPC Masters Competition China was successfully held in Pudong, Shanghai. This year’s competition, was the largest in the history of the Greater China region, bringing nearly 400 electronics industry elites from 18 provinces and municipalities.
Winners of IPC Hand Soldering and Rework Competition at NEPCON Thailand 2024 Announced
07/05/2024 | IPCIn conjunction with NEPCON Thailand 2023, IPC hosted its popular IPC Hand Soldering and Rework Competition in Bangkok, on June 19-22, 2024. The seventh edition of the competition in Thailand welcomed 40 participants from 14 companies.