TUC Receives IPC-4101E Validation Services QPL Certification
October 17, 2017 | TUCEstimated reading time: 1 minute
George Hsin, chief strategy officer of Taiwan Union Technology Corporation (TUC), is pleased to announce that TUC has gained certification to IPC-4101E Validation Services for three more products. TU-863, TU-863+, TU-863P MF and TU-865 are now listed on the IPC website under QPL Specification Sheet 130 in addition to TU-862 HF which was the first product so listed. To earn the QPL, TUC successfully completed an intensive audit based on IPC’s foremost standard on base materials for laminates and prepregs: IPC- 4101, Specification for Base Materials for Rigid and Multilayer Printed Boards and passed the qualification tests at Microtek Laboratories China, an IPC Validation Services approved, independent test lab.
Specification Sheet 130 outlines performance requirements for copper-clad laminates and prepregs comprised of modified multifunctional epoxy resin using halogen-free constituents to provide a UL-94 V-0 flame rating. The Tg must be greater than 170 degrees C.
As a specification sheet 130 QPL product, TUC’s TU-862 HF is suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work.
TU-862 HF laminates also exhibit superior chemical resistance, thermal stability for lead free soldering assembly and CAF resistance.
For these IPC-4101E/130 certified five products, TUC met or exceeded the IPCs Validation Services QPL requirements for producing materials used by printed circuit board manufacturers in the electronics industry. Thus, the company is now listed as an IPC trusted source capable of manufacturing in accordance with industry best practices. TUC and other trusted sources of suppliers can be found on IPC’s QML/QPL (Qualified Product Listing) database.
About TUC
TUC is a leading global developer and manufacturer of prepregs and laminates for the electronics industry. We work relentlessly to provide materials that deliver solutions for present and future designs by partnering with our customers, as well as market-leading OEM’s. With this partnership, we are able to offer outstanding value with unparalleled service and support.
TUC is committed to innovation and leading technologies while maintaining product manufacturability. Our products deliver excellent resistance to moisture and chemicals as well as industry leading anti-CAF and CTE properties. We provide superior global technical resources and a competitive edge to equip customers with solutions that generate extraordinary value.
Please visit the TUC website.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.