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Two Prevalent Rework Heating Methods--Which One is Best?
November 7, 2017 | Bob Wettermann, BEST Inc.Estimated reading time: 4 minutes
Figure 3: Focused IR heating technology for PCB rework.
While the infrared heating source has some distinct benefits over the hot air systems, it too has some shortcomings as a reflow source for BGA rework. There are still some underpowered IR heaters on the market which means that the rework process cycle time is much longer than a properly-designed nozzle and hot air system. This means that for very large boards such as servers, backplanes and other high current-carrying PCBs, the IR heat source may not be sufficient. The user needs to be aware that IR systems using medium wavelength IR resulting in darker-colored components have a different absorption of heat energy than light-colored components. In some cases, this means that the user must employ an ESD-safe black tape to make sure the component heats up to the right heat energy levels. Process control can be difficult with infrared heating as the absorbency spectrum and therefore reproducibility from component to component and board to board results can be an issue.
Both hot air and IR heat sources have their place in PCB rework with specific choices of rework heat source dependent upon the application at hand.
This article was originally published in the November 2017 issue of SMT Magazine.
Page 2 of 2Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.