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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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North American EMS Orders Climb Despite Lower September Shipments

10/28/2026 | Global Electronics Association
The Global Electronics Association announced the September 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.68.

UL Solutions Opens Expanded Product Testing Facility in Vietnam

10/27/2026 | BUSINESS WIRE
UL Solutions Inc., a global leader in applied safety science, announced the opening of its expanded Ho Chi Minh City facility, enhancing local testing and compliance support for manufacturers, retailers and brands in Vietnam and Southeast Asia.

GlobalFoundries Launches Advanced Facilities Control Centre in Singapore

10/26/2026 | GlobalFoundries
GlobalFoundries opened its Advanced Facilities Control Centre (AFCC) at its Singapore site, advancing the company’s leadership in digitally-enabled semiconductor manufacturing.

Global EMS Market to Grow by $202.7 Billion Through 2030

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Cadence announced the Maestro AI Model Portfolio, which powers Cadence® AI Super Agents across semiconductor and system design workflows.

Global Electronics Association's ADEPT Council Deepens Taiwan Presence as First Satellite Council Holds Inaugural In-Person Meeting

10/23/2026 | Global Electronics Association
The Global Electronics Association's Advanced Electronic Packaging Technology (ADEPT) Leadership Council is deepening its presence in Taiwan.
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