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Würth Elektronik and HKSTP Sign New Engineering Service Program

06/05/2025 | Wurth Elektronik
Würth Elektronik and the Hong Kong Science and Technology Parks Corporation (HKSTP) have signed a comprehensive cooperation agreement to promote development and production in Hong Kong. Around 100 start-ups and Small and Midsized Enterprizes (SMEs) in the field of microelectronics, as well as Hong Kong's entire production ecosystem, will benefit from local development support, knowledge transfer, and partner network of the well-known component manufacturer.

OSI Systems Receives $47 Million Services Order for Security Inspection Systems

05/30/2025 | BUSINESS WIRE
OSI Systems, Inc. announced that its Security division received a $47 million order from a U.S. based customer to provide ongoing maintenance service for its installed base of Rapiscan® inspection systems that are utilized for screening baggage, cargo and vehicles.

MKS Opens New State-of-the-Art Facility in Derio, Spain to Strengthen Iberian and Southern European Presence

05/28/2025 | MKS’ Atotech
MKS’ Atotech, a leading surface finishing brand of MKS Instruments, proudly announces the official opening of its new facility in Derio, Bizkaia, Spain, a strategic investment designed to support the company’s General Metal Finishing business across the Iberia Region, including Spain and Portugal.

Honeywell Expands Defense Modernization Efforts in Japan with New Aerospace Technologies

05/26/2025 | Honeywell
Honeywell announced the expansion of its support for Japan’s defense modernization efforts with the delivery of advanced aerospace systems for two key helicopter programs. These latest awards expand Honeywell’s footprint in Japan’s defense sector and reinforce the company’s commitment to mission readiness and long-term operational performance.

TI Teams with NVIDIA to Bring Efficient Power Distribution to AI Infrastructure

05/26/2025 | Texas Instruments
Texas Instruments technologies will help enable NVIDIA's future 800V high-voltage DC power-distribution systems for next-generation AI data centers.
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