Fast Flowing Heat in Graphene Heterostructures
November 30, 2017 | ICFOEstimated reading time: 1 minute

Nanoscale heat flow plays a crucial role in many modern electronic and optoelectronic applications, such as thermal management, photodetection, thermoelectrics and data communication. Two-dimensional layered materials are beginning to confirm their groundbreaking role in many of these applications. Perhaps even more promising are so-called van der Waals heterostructures, consisting of different layered two-dimensional materials stacked one on top of the other. These stacks can consist of materials with dramatically different physical properties, while the interfaces between them are ultraclean and atomically sharp.
Scientists from the European Graphene Flagship, led by ICFO researchers, have recently succeeded in observing and following, in real-time, the way in which heat transport occurs in van der Waals stacks, which consist of graphene encapsulated by the dielectric two-dimensional material hexagonal BN (hBN).
In a study, recently published in Nature Nanotechnology entitled “Out-of-plane heat transfer in van der Waals stacks through electron–hyperbolic phonon coupling” , ICFO researchers Klaas-Jan Tielrooij, Niels C. H. Hesp, Mark B. Lundeberg, Mathieu Massicotte, Peter Schmidt, and Diana Davydovskaya, led by ICREA Prof at ICFO Frank Koppens, in collaboration with researchers from The Netherlands, Italy, Germany, and United Kingdom, have identified a highly surprisingly effect: rather than staying within the graphene sheet, the heat actually flows to the surrounding hBN sheets. This out-of-plane heat transfer process occurs on an ultrafast timescale of picoseconds (one millionth of a millionth of a second), and is therefore dominant over competing (in-plane) heat transfer processes.
The heat transfer process occurs through hot graphene electrons (experimentally generated by incident light) that couple to hyperbolic phonon-polaritons in the hBN sheets. These phonon-polaritons propagate within the hBN as light does in an optical fiber, but in this case for infrared wavelengths and at the nanometer scale. It turns out that these exotic hyperbolic modes are very efficient at carrying heat away.
The results of this work will definitely have far-reaching implications for many applications based on hBN-encapsulated graphene, sometimes referred to as the next generation graphene platform, owing to its superior electrical properties. In particular, it will provide direction to optoelectronic device design, where these heat flow processes can be thoroughly exploited.
Suggested Items
Electroninks Acquires Complete UTDots Advanced Materials Nanoinks Portfolio and IP
05/19/2025 | ElectroninksElectroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, announced it has officially completed its full acquisition of UTDots products and IP into its portfolio, further expanding its offerings in digital printing for high-performance applications.
Future-proofing Electronics: ChemFORWARD Works Toward Collaboration for Safer Chemistry
05/19/2025 | Rachel Simon, ChemFORWARDThe electronics industry is facing a critical juncture. As consumer demand for sustainable products rises and regulatory pressures intensify, companies must prioritize the safety of their products and processes. This means not only complying with evolving chemical restrictions but also proactively seeking safer alternatives.
From DuPont to Qnity: A Bold Move in Electronics Materials
05/14/2025 | Marcy LaRont, I-Connect007DuPont has announced the intended spinoff of a public independent electronics company, Qnity, which will serve as a solutions provider to the semiconductor and electronics industries to enhance competitiveness and innovation in advanced computing, smart technologies, and connectivity. In this interview, Jon Kemp, Qnity CEO-elect and current president of DuPont’s Electronics business, shares his insights on the strategic separation from DuPont.
SMC Korea 2025 to Spotlight Next-Generation Memory and Materials Innovation amid AI Boom
05/13/2025 | SEMIThe Strategic Materials Conference (SMC) Korea 2025 is set to convene on May 14 at the Suwon Convention Center in Gyeonggi-do, South Korea, bringing together leading experts and innovators to highlight the critical role of materials innovation in addressing the performance, efficiency, and scalability requirements of AI-enabled semiconductor devices.
SEMI Applauds New Bill to Clarify Tax Credit Eligibility for Critical Semiconductor Suppliers Under U.S. CHIPS Act
05/12/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced support of the Strengthening Essential Manufacturing and Industrial Investment Act (SEMI Investment Act), which clarifies that critical materials suppliers to semiconductor manufacturers are eligible for the Advanced Manufacturing Investment Tax Credit (“Section 48D”) created by the United States CHIPS and Science Act.