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Koh Young Europe Ready for Next Year, and Beyond
December 18, 2017 | Andy Shaughnessy, I-Connect007Estimated reading time: 7 minutes
Eppinger: Exactly. They see it first as a burden. But if the tool is proper, and you see a line, and you see some nice graphs, it becomes more software-driven and usable. You see more terminals than machines. We simply must believe that the machine performs, because it has been proven. But now, it is a way to visualize what you can gain out of the machine.
We are quite happy that we have entered this world. As you know, we started with SPI, so we were also as a niche player, and then moved into solder, then the introduction of 3D AOI was also kind of a niche product. And as you can see, today it’s state-of-the-art 3D. If you don't have 3D, you are not really competitive anymore. Moreover, it is no longer a niche, full 3D is the industry standard—our standard.
Still, there's a difference between full 3D and 2.5D solutions in the market. With the outlook in the data management and the Industry 4.0, machine to machine communication, all these aspects, you need to have a rock-solid base. Otherwise your conclusion, your assumption, all your decisions will be based on wrong data. I think this is the combination of the success. That's what we must harmonize. I think we are in leading position here.
Shaughnessy: Is there anything else we haven't covered that you'd like to discuss?
Eppinger: I can only say thank you to all of our customers. They pushed us in the right direction. We could meet their expectations. Also, a thank you to the market, because it's not the success of Koh Young alone. People have to believe in the product. People must believe in the company, and people ought to believe in a philosophy which helps them later as a benefit. So, I am thankful for the market, and looking forward as our customers drive us with some crazy ideas that will become the standard in a few months or years.
Shaughnessy: Great. Thank you, Harald. I appreciate your time.
Eppinger: Thank you very much.
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