Printed Circuits Adds Engineering Manager Paul Peters and New Plating Capability in 2018
January 11, 2018 | Printed CircuitsEstimated reading time: 1 minute
Flex and rigid-flex circuit board manufacturer, Printed Circuits has started 2018 with a few enhancements to their wet processing department, starting with the appointment of Paul Peters to engineering manager of their plating and wet processing departments.
"Paul Peters brings a wealth of wet processing talent and experience to Printed Circuits. We are delighted to have his skill set added to our engineering talent," said Ken Tannehill, president and CEO. Paul has 39 years experience in wet processing in the PWB manufacturing industry and has worked with industry leaders MacDermid, OMG, and Electrochemicals, as well as Printed Circuits in previous positions.
"The timing of Paul's hire was ideal as we have just added electroplated platinum to our final finish capabilities," said Matt Tannehill, executive vice president. "Electroplated platinum is desirable as a final finish when folks are looking to use flexible circuits in implantable devices for medical applications," Matt continued. "It is ideal when electrodes or circuits will come into contact with human tissue or fluids, which is typical in implantable medical electronics applications that are growing in popularity."
About Printed Circuits
Printed Circuits is a US manufacturer of multilayer flex and rigid-flex printed circuit boards with over 40 years of experience building circuits typically used in high reliability applications such as medical, military and commercial electronics where customers place a premium on reliability, package density, and weight. For more information, click here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.