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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

I-Connect007 Expands Technical Library With New Companion Guide to The Printed Circuit Assembler’s Guide to… Factory Analytics

09/30/2026 | I-Connect007
I-Connect007 is pleased to announce the release of Factory Analytics on the Floor: How Connected Data Drives Better Decisions, a new companion guide to The Printed Circuit Assembler’s Guide to… Factory Analytics: Unlocking Efficiency Through Data Insights, by Cogiscan. Designed to bring factory analytics into a practical, real-world setting, the guide follows a day on the factory floor as operators and engineers go beyond basic KPIs to connect machine data, inspection results, process conditions, and human expertise. Together, these insights provide a clearer picture of what’s happening in production and where improvements can have the greatest impact.

Elementary, Mr. Watson: Waking Up Europe's PCB Giants

09/30/2026 | John Watson -- Column: Elementary, Mr. Watson
When I wrote "The Rise and Fall of Europe’s PCB Design Community,” for the September issue of I-Connect007 Magazine, I wasn't suggesting Europe had suddenly solved its PCB problems; far from it. The region still faces high costs, dependence on imported electronics, shrinking capacity, and a supply chain that has lost too much ground. I used the word awakening because the technical ability never disappeared. The engineers, researchers, equipment builders, and manufacturers are still here. The question is whether Europe can connect them before more capability slips away.

Celebrating One Year of the Advanced Electronic Packaging Technology Council (ADEPT): From Momentum to Measurable Impact

09/15/2026 | Devan Iyer, Global Electronics Association
Nearly 15 months ago, we launched the Advanced Electronic Packaging Technology Council with a simple premise: the packaging challenges facing our industry are moving too fast—and spanning too many disciplines—for any single company, region, or segment to solve alone. What we’ve seen since then is proof that focused, industry-led collaboration can turn urgency into alignment, and alignment into action.

Connecting Quality, Traceability, and Manufacturing Processes

09/09/2026 | Scott Ryan, Cetec ERP
Traceability is easy to describe and difficult to maintain. From the moment a component arrives, its supplier lot, inspection results, certificates, and eventual use in production have to be captured and carried forward into the finished assembly and shipment. Every step creates and requires information. In EMS and PCB assembly, products involve thousands of components, multiple levels of subassemblies, customer-specific requirements, revision changes, and supplier documents arriving in any number of formats. This becomes infinitely more difficult when quality, inventory, production, and document management live in separate systems.

Workforce Partnerships Mean New Apprenticeships and Funding Opportunities

09/02/2026 | Victoria Hawkins, Global Electronics Association
Workforce development is most effective when employers have access to both a proven training model and the financial resources needed to implement it. At the Global Electronics Association, our workforce partnerships team is expanding those connections by helping electronics employers recruit, train, retain, and advance their workers through Registered Apprenticeship and industry-focused funding opportunities. We are excited to be in the final stages of preparing and submitting our newest Registered Apprenticeship occupation: wire harness assembler.
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