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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Foxconn Research Develops 34.1 Tbps Silicon Photonics Technology

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Foxconn Research Institute, in collaboration with National Yang Ming Chiao Tung University, has developed a 34.132 Tbps ultra-high-capacity silicon photonics transmission technology designed to address growing data bandwidth demands driven by artificial intelligence (AI).

SPARK Microsystems Expands European Distribution Network with Alcom Electronics

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SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, announced the expansion of its distribution channel in Northwest Europe, welcoming Alcom Electronics to SPARK’s partner network.

Mega Circuit Chooses atg Flying Probe Technology for High-speed Electrical Test and Automation

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Marvell Invests $250M in India to Expand AI Development

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Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced plans to invest $250 million in India over the next three years to expand its capabilities across technology, talent and infrastructure.

Amkor, NVIDIA Partner to Expand AI Packaging and Test

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Amkor Technology, Inc. announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms.
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