Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

The ICAPE Group Announces the Launch of Its E-Shop at Electronica

10/31/2024 | BUSINESS WIRE
The ICAPE Group, a global technology distributor of printed circuit boards (PCB) and custom-made electromechanical parts, today announced its participation at the 2024 edition of Electronica, where it will present the ICAPE Shop, its new online purchasing platform.

DuPont Earns Best Partner Award for Innovation from Samsung Electronics

10/31/2024 | DuPont
DuPont announced it has been selected for the 2024 Best Partner Award from Samsung Electronics in the Innovation category.

Are Firms Holding Too Much Inventory?

10/30/2024 | Shawn DuBravac, IPC
In the aftermath of the 2008 financial crisis, manufacturers made significant adjustments to inventory management strategies as they faced sharp declines in demand and economic uncertainty. Manufacturers moved to scale back production and attempted to quickly reduce inventory levels. Post-crisis, many manufacturers adopted lean inventory practices, such as just-in-time (JIT) production, to minimize holding costs and illiquidity risks.

Combatting Advanced Techniques in Counterfeiting

10/30/2024 | Anthony Bryant
In today's interconnected global marketplace, counterfeit electronics pose a significant threat to industries ranging from aerospace and defense to healthcare and telecommunications. As counterfeiters employ increasingly sophisticated techniques, the need for robust strategies to prevent, mitigate, and identify counterfeit components has become critical. This article explores the advanced techniques used in counterfeiting, the potential involvement of state-owned enterprises (SOEs), and comprehensive strategies for combating this pervasive issue.

ESCATEC Pushes New Boundaries in Micro-electronics with UV Enhanced Die Bonder Technology

10/30/2024 | ESCATEC
Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in