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Mycronic Receives Order for an SLX Mask Writer

06/19/2026 | Mycronic
Mycronic AB has received an order for an SLX mask writer from a new customer in Europe. The order value is in the range of USD 6-8 million. Delivery of the system is planned for the third quarter of 2026.

Smart Automation: When Traditional Depaneling Methods Reach Their Limits

06/16/2026 | Josh Casper -- Column: Smart Automation
PCB depaneling has traditionally been viewed as a relatively straightforward process in electronics manufacturing. Once the assembly process is complete, boards are separated from the panel and moved downstream for final assembly, test, or packaging. For years, manufacturers have relied on methods such as routing, V-score separation, and punch systems to handle this step efficiently and cost-effectively.

Chase Corporation Acquires Sheldahl

06/15/2026 | PR Newswire
Chase Corporation, a leading global provider of engineered materials for high-reliability applications, today announced it has acquired Sheldahl from Flex. Sheldahl designs and manufactures specialized coated films, laminates, and flexible circuit technologies for aerospace, automotive, industrial, and medical markets.

APE Boosts Eyelet and Funnellet Output, Cuts Prices Up to 35%

06/15/2026 | APE
Automated Production Equipment (APE) has significantly expanded production of its most popular PCB eyelets and funnellets, allowing delivery of  these products at what may be the most competitive pricing in the industry, according to Casey Scheu, CEO.

MKS’ Atotech, ESI to Highlight Integrated PCB and Advanced Packaging Solutions at JPCA 2026

06/08/2026 | Atotech
MKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will present their latest innovations in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing at the JPCA Show in Tokyo, Japan, from June 10-12.
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